Jin Hui MENG

Person

  • Kwai Chung, HK

Patents Grantslast 30 patents

  • Information Patent Grant

    Universal die detachment apparatus

    • Patent number 8,470,130
    • Issue date Jun 25, 2013
    • ASM Assembly Automation LTD
    • Chi Ming Chong
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    DIE BONDING TOOL AND SYSTEM

    • Publication number 20160086830
    • Publication date Mar 24, 2016
    • Kwok Yuen CHEUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNIVERSAL DIE DETACHMENT APPARATUS

    • Publication number 20110088845
    • Publication date Apr 21, 2011
    • Chi Ming CHONG
    • H01 - BASIC ELECTRIC ELEMENTS