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Jin Hui MENG
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Kwai Chung, HK
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Patents Grants
last 30 patents
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Patent Grant
Universal die detachment apparatus
Patent number
8,470,130
Issue date
Jun 25, 2013
ASM Assembly Automation LTD
Chi Ming Chong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
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Patent Application
DIE BONDING TOOL AND SYSTEM
Publication number
20160086830
Publication date
Mar 24, 2016
Kwok Yuen CHEUNG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
UNIVERSAL DIE DETACHMENT APPARATUS
Publication number
20110088845
Publication date
Apr 21, 2011
Chi Ming CHONG
H01 - BASIC ELECTRIC ELEMENTS