Jin JISONG

Person

SHANGHAI, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,096,696
- Issue date Sep 17, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- G11 - INFORMATION STORAGE
Information Patent Grant
Improving resolution of masks for semiconductor manufacture
- Patent number 12,087,582
- Issue date Sep 10, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,080,596
- Issue date Sep 3, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation method and mask
- Patent number 11,810,787
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process manufacturing method, method for adjusting threshold voltag...
- Patent number 11,809,802
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Abraham Yoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,810,903
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 11,769,691
- Issue date Sep 26, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,769,672
- Issue date Sep 26, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,742,355
- Issue date Aug 29, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device using mask layer and sidew...
- Patent number 11,721,553
- Issue date Aug 8, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,664,234
- Issue date May 30, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,651,964
- Issue date May 16, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,637,092
- Issue date Apr 25, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,631,743
- Issue date Apr 18, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Abraham Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,631,744
- Issue date Apr 18, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,626,497
- Issue date Apr 11, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,532,513
- Issue date Dec 20, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with gate contact
- Patent number 11,508,726
- Issue date Nov 22, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Jisong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,443,955
- Issue date Sep 13, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and formation method thereof
- Patent number 11,437,378
- Issue date Sep 6, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,355,351
- Issue date Jun 7, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and fabrication methods thereof
- Patent number 11,335,560
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,322,353
- Issue date May 3, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,309,318
- Issue date Apr 19, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,309,183
- Issue date Apr 19, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Jisong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 11,239,088
- Issue date Feb 1, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,183,384
- Issue date Nov 23, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory (SRAM) and forming method thereof
- Patent number 11,145,661
- Issue date Oct 12, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,011,608
- Issue date May 18, 2021
- Semiconductor Manufacturing (Shanghai) International Corporation
- Jin Jisong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming a semiconductor stru...
- Patent number 11,011,416
- Issue date May 18, 2021
- Semiconductor Manufacturing (Shanghai) International Corporation
- Jin Jisong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250079391
- Publication date Mar 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250046776
- Publication date Feb 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME
- Publication number 20250040159
- Publication date Jan 30, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250015081
- Publication date Jan 9, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240313042
- Publication date Sep 19, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240274466
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY CELL AND MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20240276889
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY CELL AND MEMORY
- Publication number 20240274175
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240266289
- Publication date Aug 8, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMATION METHOD, AND OPERATION METHOD
- Publication number 20240250087
- Publication date Jul 25, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186233
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186253
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240178186
- Publication date May 30, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240178203
- Publication date May 30, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240113157
- Publication date Apr 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF, AND PHOTOMASK L...
- Publication number 20240006515
- Publication date Jan 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Kuchanari SUBHASH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230411444
- Publication date Dec 21, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20230352417
- Publication date Nov 2, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20230352467
- Publication date Nov 2, 2023
- Semiconductor Manufacturing Intemational (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20230352468
- Publication date Nov 2, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230299075
- Publication date Sep 21, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230292483
- Publication date Sep 14, 2023
- Semiconductor Manufacturing Intemational (Shanghai) Corporation
- Zhuofan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230282570
- Publication date Sep 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230230963
- Publication date Jul 20, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230215927
- Publication date Jul 6, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230056668
- Publication date Feb 23, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220328484
- Publication date Oct 13, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328642
- Publication date Oct 13, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20220319863
- Publication date Oct 6, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220199791
- Publication date Jun 23, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure and fabrication method thereof

Improving resolution of masks for semiconductor manufacture

Semiconductor structure and forming method thereof

Semiconductor structure formation method and mask

Process manufacturing method, method for adjusting threshold voltag...

Semiconductor structure and forming method thereof

Semiconductor device and formation method thereof

Semiconductor structure and forming method thereof

Semiconductor structure

Formation method of semiconductor device using mask layer and sidew...

Semiconductor structure and fabrication method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and fabrication method thereof

Semiconductor structure with gate contact

Semiconductor device and fabrication method thereof

Semiconductor structure and formation method thereof

Semiconductor device and fabrication method thereof

Semiconductor devices and fabrication methods thereof

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Semiconductor structure and forming method thereof

Semiconductor device and formation method thereof

Semiconductor device and fabrication method thereof

Static random access memory (SRAM) and forming method thereof

Semiconductor structure and method for forming the same

Semiconductor structure and method for forming a semiconductor stru...

Patents Applicationslast 30 patents

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

MAGNETIC RANDOM ACCESS MEMORY CELL AND MAGNETIC RANDOM ACCESS MEMORY

MAGNETIC RANDOM ACCESS MEMORY CELL AND MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE, FORMATION METHOD, AND OPERATION METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF, AND PHOTOMASK L...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF