Jin Nasukawa

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Resin composition and molding method thereof

    • Patent number 11,807,751
    • Issue date Nov 7, 2023
    • Hemicellulose Ltd.
    • Seiji Morita
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Resin composition and molding method thereof

    • Patent number 11,767,382
    • Issue date Sep 26, 2023
    • Hemicellulose Ltd.
    • Seiji Morita
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    Resin Composition and Molding Method Thereof

    • Publication number 20200270379
    • Publication date Aug 27, 2020
    • Business Innovation Partners Co., Ltd.
    • Seiji Morita
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Resin Composition and Molding Method Thereof

    • Publication number 20200270430
    • Publication date Aug 27, 2020
    • Business Innovation Partners Co., Ltd.
    • Seiji Morita
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL