Jin-Neng Wu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including uneven contact in passivation layer
- Patent number 11,658,138
- Issue date May 23, 2023
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit structure
- Patent number 11,610,857
- Issue date Mar 21, 2023
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including uneven contact in passivation layer...
- Patent number 11,309,267
- Issue date Apr 19, 2022
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,145,627
- Issue date Oct 12, 2021
- Winbond Electronics Corp.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure and method of manufacturing th...
- Patent number 11,063,010
- Issue date Jul 13, 2021
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER
- Publication number 20220181282
- Publication date Jun 9, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE
- Publication number 20220059483
- Publication date Feb 24, 2022
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER...
- Publication number 20220020711
- Publication date Jan 20, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT STRUCTURE
- Publication number 20210407946
- Publication date Dec 30, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210104492
- Publication date Apr 8, 2021
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350268
- Publication date Nov 5, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20200251434
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200251435
- Publication date Aug 6, 2020
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Jin-Neng Wu

Person

Patents Grantslast 30 patents

Semiconductor device including uneven contact in passivation layer

Method of manufacturing circuit structure

Semiconductor device including uneven contact in passivation layer...

Semiconductor package and manufacturing method thereof

Redistribution layer (RDL) structure and method of manufacturing th...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER

CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE

SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER...

METHOD OF MANUFACTURING CIRCUIT STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

REDISTRIBUTION LAYER (RDL) STRUCTURE AND METHOD OF MANUFACTURING TH...

CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME