Jin-Wei You

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package, electronic packaging module having the electron...
- Patent number 11,443,994
- Issue date Sep 13, 2022
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging structure and method for manufacturing the ele...
- Patent number 11,143,549
- Issue date Oct 12, 2021
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate structure and fabrication method thereof
- Patent number 9,907,161
- Issue date Feb 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, ELECTRONIC PACKAGING MODULE HAVING THE ELECTRON...
- Publication number 20210057300
- Publication date Feb 25, 2021
- SILICONWAR E PR ECISION INDUSTRIES CO., LT D.
- Jin-Wei You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210018360
- Publication date Jan 21, 2021
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR FABRICATING AN ELECTRONIC DEVICE, AND...
- Publication number 20180139844
- Publication date May 17, 2018
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF SUBSTRATE STRUCTURE
- Publication number 20180139840
- Publication date May 17, 2018
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160128184
- Publication date May 5, 2016
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR