Jin Yang

Person

Jiangyin City, CN

People

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20230386952
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGING SYSTEM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230386967
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20230343669
- Publication date Oct 26, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PRE...
- Publication number 20230335526
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230335507
- Publication date Oct 19, 2023
- SJ Semiconductor (Jiangyin ) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2.5D/3D ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20230335478
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Chengchung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURIN...

WAFER PACKAGING SYSTEM AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGING STRUCTURE

HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PRE...

CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

2.5D/3D ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING...