Jin Yoong Liong

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Seremban, MY

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Patents Grantslast 30 patents

Information Patent Grant
Molded wafer level packaging
- Patent number 10,916,485
- Issue date Feb 9, 2021
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded wafer level packaging
- Patent number 10,559,510
- Issue date Feb 11, 2020
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED WAFER LEVEL PACKAGING
- Publication number 20200126880
- Publication date Apr 23, 2020
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLAT...
- Publication number 20200035586
- Publication date Jan 30, 2020
- Semiconductor Components Industries, LLC
- Jin Yoong LIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED WAFER LEVEL PACKAGING
- Publication number 20190067143
- Publication date Feb 28, 2019
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR EXTENDING DIE SIZE AND PACKAGED SEMICONDUCTOR...
- Publication number 20160104662
- Publication date Apr 14, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS