Jin-Zhong Yao

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method to manufacture the integrated...
- Patent number 11,784,112
- Issue date Oct 10, 2023
- NXP USA, INC.
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from metal migration on IC packages
- Patent number 11,417,541
- Issue date Aug 16, 2022
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with bendable leads
- Patent number 10,515,880
- Issue date Dec 24, 2019
- NXP USA, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having stacked die and method for therefor
- Patent number 10,446,476
- Issue date Oct 15, 2019
- NXP USA, INC.
- Leo M. Higgins
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of assembling QFP type semiconductor device
- Patent number 10,290,593
- Issue date May 14, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and Gull Wi...
- Patent number 10,217,700
- Issue date Feb 26, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and gull wi...
- Patent number 10,181,434
- Issue date Jan 15, 2019
- NXP USA, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with dummy leads for burr mitigation during encapsulation
- Patent number 10,037,935
- Issue date Jul 31, 2018
- NXP USA, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity type pressure sensor device
- Patent number 9,890,034
- Issue date Feb 13, 2018
- NXP B.V.
- Zhigang Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Combined QFN and QFP semiconductor package
- Patent number 9,589,928
- Issue date Mar 7, 2017
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating mold tool for semicondcutor packaging
- Patent number 9,443,746
- Issue date Sep 13, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package with mold lock
- Patent number 9,362,211
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded type semiconductor package and method of assembling same
- Patent number 9,214,447
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with webbing between leads
- Patent number 9,190,351
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC. AUSTIN
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame based semiconductor die package
- Patent number 8,901,721
- Issue date Dec 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die with cap element
- Patent number 8,859,336
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold chase
- Patent number 8,859,339
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,802,474
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor device including insulating subs...
- Patent number 8,722,465
- Issue date May 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,716,846
- Issue date May 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Grant
Power device and method of packaging same
- Patent number 8,709,875
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor device including insulating subs...
- Patent number 8,643,170
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 8,525,311
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor package with improved standoff
- Patent number 8,481,369
- Issue date Jul 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device and method of assembling same
- Patent number 8,466,539
- Issue date Jun 18, 2013
- Freescale Semiconductor Inc.
- Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor package
- Patent number 8,216,886
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Bin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor device
- Patent number 8,115,288
- Issue date Feb 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yongsheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with solder flow control
- Patent number 8,050,048
- Issue date Nov 1, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor integrated circuit package and method of packaging se...
- Patent number 7,727,817
- Issue date Jun 1, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED...
- Publication number 20220399257
- Publication date Dec 15, 2022
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM METAL MIGRATION ON IC PACKAGES
- Publication number 20210066092
- Publication date Mar 4, 2021
- NXP USA, Inc.
- Zhigang Bai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LEAD FRAME WITH BENDABLE LEADS
- Publication number 20190287883
- Publication date Sep 19, 2019
- NXP USA, Inc.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20190088576
- Publication date Mar 21, 2019
- NXP USA, Inc.
- LEO M. HIGGINS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE
- Publication number 20190074254
- Publication date Mar 7, 2019
- NXP USA, Inc.
- ZHIGANG BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TYPE PRESSURE SENSOR DEVICE
- Publication number 20170362077
- Publication date Dec 21, 2017
- NXP USA,INC.
- ZHIGANG BAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH INSPECTABLE SOLDER JOINTS
- Publication number 20160056097
- Publication date Feb 25, 2016
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING
- Publication number 20160049318
- Publication date Feb 18, 2016
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE
- Publication number 20150294924
- Publication date Oct 15, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150294929
- Publication date Oct 15, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WEBBING BETWEEN LEADS
- Publication number 20150206831
- Publication date Jul 23, 2015
- Freescale Seminconductor, Inc.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONT...
- Publication number 20150097278
- Publication date Apr 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150028468
- Publication date Jan 29, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140361421
- Publication date Dec 11, 2014
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE DIE ATTACHMENT
- Publication number 20140284806
- Publication date Sep 25, 2014
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20140206124
- Publication date Jul 24, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20140191383
- Publication date Jul 10, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...
- Publication number 20140127862
- Publication date May 8, 2014
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20130249071
- Publication date Sep 26, 2013
- Jinzhong Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD CHASE
- Publication number 20130196473
- Publication date Aug 1, 2013
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130049183
- Publication date Feb 28, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...
- Publication number 20120264258
- Publication date Oct 18, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Junhua LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
- Publication number 20120238058
- Publication date Sep 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Junhua LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20120211846
- Publication date Aug 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120168884
- Publication date Jul 5, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120139067
- Publication date Jun 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- WAI YEW LO
- G01 - MEASURING TESTING
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20120056311
- Publication date Mar 8, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION
- Publication number 20110263077
- Publication date Oct 27, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20110248393
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yongsheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR PACKAGE
- Publication number 20110193237
- Publication date Aug 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Bin Tian
- H01 - BASIC ELECTRIC ELEMENTS

Jin-Zhong Yao

Person

Patents Grantslast 30 patents

Integrated circuit package and method to manufacture the integrated...

Protection from metal migration on IC packages

Lead frame with bendable leads

Packaged integrated circuit having stacked die and method for therefor

Method of assembling QFP type semiconductor device

Lead frame for integrated circuit device having J-leads and Gull Wi...

Lead frame for integrated circuit device having J-leads and gull wi...

Lead frame with dummy leads for burr mitigation during encapsulation

Cavity type pressure sensor device

Combined QFN and QFP semiconductor package

Floating mold tool for semicondcutor packaging

Exposed pad integrated circuit package with mold lock

Quad flat non-leaded semiconductor package with wettable flank

Non-leaded type semiconductor package and method of assembling same

Semiconductor device with webbing between leads

Lead frame based semiconductor die package

Method of packaging semiconductor die with cap element

Mold chase

Pressure sensor and method of packaging same

Method of assembling semiconductor device including insulating subs...

Pressure sensor and method of packaging same

Power device and method of packaging same

Method of assembling semiconductor device including insulating subs...

Lead frame for semiconductor device

Method of making semiconductor package with improved standoff

MRAM device and method of assembling same

Method for making semiconductor package

Lead frame for semiconductor device

Lead frame with solder flow control

Semiconductor integrated circuit package and method of packaging se...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED...

PROTECTION FROM METAL MIGRATION ON IC PACKAGES

LEAD FRAME WITH BENDABLE LEADS

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR

METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE

CAVITY TYPE PRESSURE SENSOR DEVICE

SEMICONDUCTOR DEVICE WITH INSPECTABLE SOLDER JOINTS

FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING

COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR DEVICE WITH WEBBING BETWEEN LEADS

SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONT...

NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME

LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR DEVICE DIE ATTACHMENT

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

POWER DEVICE AND METHOD OF PACKAGING SAME

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

MOLD CHASE

POWER DEVICE AND METHOD OF PACKAGING SAME

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...

METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

LEADFRAME FOR SEMICONDUCTOR DEVICE

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

LEAD FRAME FOR SEMICONDUCTOR DEVICE

METHOD FOR MAKING SEMICONDUCTOR PACKAGE