Jinbang Tang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 12,027,485
- Issue date Jul 2, 2024
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant carrier based packaging with enhanced WG m...
- Patent number 11,862,584
- Issue date Jan 2, 2024
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,502,054
- Issue date Nov 15, 2022
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,462,505
- Issue date Oct 4, 2022
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with compact antenna formed using three-dimen...
- Patent number 11,121,467
- Issue date Sep 14, 2021
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radio package having a built-in multi directional antenn...
- Patent number 11,101,542
- Issue date Aug 24, 2021
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged pressure sensor device
- Patent number 10,822,224
- Issue date Nov 3, 2020
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna assembly for wafer level packaging
- Patent number 10,319,689
- Issue date Jun 11, 2019
- NXP USA, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having corrugated leads and method for forming
- Patent number 10,134,660
- Issue date Nov 20, 2018
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive barriers for integrated circuits
- Patent number 9,714,879
- Issue date Jul 25, 2017
- NXP USA, INC.
- Chad S. Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface between a semiconductor die and a waveguide, where the in...
- Patent number 9,666,930
- Issue date May 30, 2017
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device module with integrated antenna structure, and rel...
- Patent number 9,172,143
- Issue date Oct 27, 2015
- Freescale Semiconductor Inc.
- Jinbang Tang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a high thermal conducting semiconductor device pa...
- Patent number 9,029,202
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a conductive stud...
- Patent number 8,530,346
- Issue date Sep 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a micro electro-mechanical device
- Patent number 8,461,657
- Issue date Jun 11, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacting an electronic device module with integrated a...
- Patent number 8,407,890
- Issue date Apr 2, 2013
- Freescale Semiconductor Inc.
- Jinbang Tang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Shielding structures for signal paths in electronic devices
- Patent number 8,385,084
- Issue date Feb 26, 2013
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding for a micro electro-mechanical device and method therefor
- Patent number 8,330,239
- Issue date Dec 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing an electronic device including dies, a dielectr...
- Patent number 8,293,588
- Issue date Oct 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration standards and methods of their fabrication and use
- Patent number 8,290,736
- Issue date Oct 16, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic assembly with an embedded waveguide adapter and met...
- Patent number 8,283,764
- Issue date Oct 9, 2012
- Freescale Semiconductors, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with an embedded waveguide adapter and met...
- Patent number 8,168,464
- Issue date May 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package with shielding via r...
- Patent number 8,097,494
- Issue date Jan 17, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging millimeter wave modules
- Patent number 8,093,700
- Issue date Jan 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded multi-layer package structures
- Patent number 8,004,068
- Issue date Aug 23, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated conformal shielding method and process using redistribut...
- Patent number 7,981,730
- Issue date Jul 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including dies, a dielectric layer, and a encapsu...
- Patent number 7,977,785
- Issue date Jul 12, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mini module EMI shielding evaluation
- Patent number 7,969,164
- Issue date Jun 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COMPACT CONNECTORS WITH INTEGRATED WIRELESS COMMUNICATION ELEMENTS
- Publication number 20240243529
- Publication date Jul 18, 2024
- NXP USA, Inc.
- Jinbang Tang
- G08 - SIGNALLING
Information Patent Application
High Dielectric Constant Carrier Based Packaging with Enhanced WG M...
- Publication number 20230207498
- Publication date Jun 29, 2023
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waveguide Launcher in Package Based on High Dielectric Constant Car...
- Publication number 20230178500
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Jinbang Tang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220415844
- Publication date Dec 29, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220149000
- Publication date May 12, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220108973
- Publication date Apr 7, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RADIO PACKAGE HAVING A BUILT-IN MULTI-DIRECTIONAL ANTENN...
- Publication number 20210159584
- Publication date May 27, 2021
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package with Compact Antenna Formed Using Three-Dimen...
- Publication number 20200403314
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20190112180
- Publication date Apr 18, 2019
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING
- Publication number 20180277464
- Publication date Sep 27, 2018
- NXP USA, Inc.
- JINBANG TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA ASSEMBLY FOR WAFER LEVEL PACKAGING
- Publication number 20170154859
- Publication date Jun 1, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BARRIERS FOR INTEGRATED CIRCUITS
- Publication number 20170052082
- Publication date Feb 23, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Chad S. Dawson
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED INTEGRATED CIRCUIT WAVEGUIDE INTERFACE AND METHODS THEREOF
- Publication number 20160118705
- Publication date Apr 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DISSIPATING HEAT FROM A DIE ASSEMBLY
- Publication number 20150187675
- Publication date Jul 2, 2015
- Jinbang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PA...
- Publication number 20140353816
- Publication date Dec 4, 2014
- Weng Foong YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130330846
- Publication date Dec 12, 2013
- Jinbang Tang
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND REL...
- Publication number 20130135152
- Publication date May 30, 2013
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE
- Publication number 20120282719
- Publication date Nov 8, 2012
- FREESCALE SEMICONDUCTOR, INC.
- JINBANG TANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METH...
- Publication number 20120223325
- Publication date Sep 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROVIDING AN ELECTRONIC DEVICE INCLUDING DIES, A DIELECTR...
- Publication number 20110230014
- Publication date Sep 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION STANDARDS AND METHODS OF THEIR FABRICATION AND USE
- Publication number 20110208467
- Publication date Aug 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND REL...
- Publication number 20110181488
- Publication date Jul 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND MET...
- Publication number 20110180917
- Publication date Jul 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES
- Publication number 20110075394
- Publication date Mar 31, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STUD...
- Publication number 20110027984
- Publication date Feb 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20110003435
- Publication date Jan 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING FOR A MICRO ELECTRO-MECHANICAL DEVICE AND METHOD THEREFOR
- Publication number 20100276766
- Publication date Nov 4, 2010
- Jinbang Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT MODULE AND METHOD OF PACKAGING SAME
- Publication number 20100267207
- Publication date Oct 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE
- Publication number 20100224969
- Publication date Sep 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS

Jinbang Tang

Person

Patents Grantslast 30 patents

Semiconductor device assembly and method therefor

High dielectric constant carrier based packaging with enhanced WG m...

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Packaged pressure sensor device

Semiconductor package with compact antenna formed using three-dimen...

Integrated radio package having a built-in multi directional antenn...

Packaged pressure sensor device

Antenna assembly for wafer level packaging

Semiconductor device having corrugated leads and method for forming

Electrically conductive barriers for integrated circuits

Interface between a semiconductor die and a waveguide, where the in...

Electronic device module with integrated antenna structure, and rel...

Method of forming a high thermal conducting semiconductor device pa...

Process of forming an electronic device including a conductive stud...

Methods for forming a micro electro-mechanical device

Method of manufacting an electronic device module with integrated a...

Shielding structures for signal paths in electronic devices

Shielding for a micro electro-mechanical device and method therefor

Method of providing an electronic device including dies, a dielectr...

Calibration standards and methods of their fabrication and use

Microelectronic assembly with an embedded waveguide adapter and met...

Microelectronic assembly with an embedded waveguide adapter and met...

Method of making an integrated circuit package with shielding via r...

Packaging millimeter wave modules

Shielded multi-layer package structures

Integrated conformal shielding method and process using redistribut...

Electronic device including dies, a dielectric layer, and a encapsu...

Method and apparatus for mini module EMI shielding evaluation

Patents Applicationslast 30 patents

COMPACT CONNECTORS WITH INTEGRATED WIRELESS COMMUNICATION ELEMENTS

High Dielectric Constant Carrier Based Packaging with Enhanced WG M...

Waveguide Launcher in Package Based on High Dielectric Constant Car...

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

INTEGRATED RADIO PACKAGE HAVING A BUILT-IN MULTI-DIRECTIONAL ANTENN...

PACKAGED PRESSURE SENSOR DEVICE

Semiconductor Package with Compact Antenna Formed Using Three-Dimen...

PACKAGED PRESSURE SENSOR DEVICE

SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING

ANTENNA ASSEMBLY FOR WAFER LEVEL PACKAGING

ELECTRICALLY CONDUCTIVE BARRIERS FOR INTEGRATED CIRCUITS

PACKAGED INTEGRATED CIRCUIT WAVEGUIDE INTERFACE AND METHODS THEREOF

METHODS AND APPARATUS FOR DISSIPATING HEAT FROM A DIE ASSEMBLY

METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PA...

TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES

ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND REL...

METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE

MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METH...

METHOD OF PROVIDING AN ELECTRONIC DEVICE INCLUDING DIES, A DIELECTR...

CALIBRATION STANDARDS AND METHODS OF THEIR FABRICATION AND USE

ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND REL...

MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND MET...

SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES

PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STUD...

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

SHIELDING FOR A MICRO ELECTRO-MECHANICAL DEVICE AND METHOD THEREFOR

INTEGRATED CIRCUIT MODULE AND METHOD OF PACKAGING SAME

ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE