Jing CAO

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and method for manufacturing the same
- Patent number 11,114,401
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer chip and fabrication method thereof
- Patent number 10,756,061
- Issue date Aug 25, 2020
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jing Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonding Structure And Method For Manufacturing The Same
- Publication number 20200365539
- Publication date Nov 19, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CHIP AND FABRICATION METHOD THEREOF
- Publication number 20190221545
- Publication date Jul 18, 2019
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Jing CAO
- H01 - BASIC ELECTRIC ELEMENTS