Jing Chai

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St. Charles, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for cleaning semiconductor wafers
- Patent number 5,839,460
- Issue date Nov 24, 1998
- MEMC Electronic Materials, Inc.
- Jing Chai
- B08 - CLEANING
Information Patent Grant
Post-lapping cleaning process for silicon wafers
- Patent number 5,837,662
- Issue date Nov 17, 1998
- MEMC Electronic Materials, Inc.
- Jing Chai
- B08 - CLEANING
Information Patent Grant
Apparatus for cleaning semiconductor wafers
- Patent number 5,626,159
- Issue date May 6, 1997
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- B08 - CLEANING
Information Patent Grant
Method for cleaning semiconductor wafers with sonic energy and pass...
- Patent number 5,593,505
- Issue date Jan 14, 1997
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- B08 - CLEANING