Jing-En LUAN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package and method of making an optical sensor package
- Patent number 12,176,220
- Issue date Dec 24, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level optical sensor packaging
- Patent number 12,002,898
- Issue date Jun 4, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded proximity sensor
- Patent number 11,988,743
- Issue date May 21, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Optical sensor package with encapsulant is between and separates su...
- Patent number 11,828,877
- Issue date Nov 28, 2023
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level chip scale package having varying thicknesses
- Patent number 11,721,657
- Issue date Aug 8, 2023
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 11,581,232
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glue bleeding prevention cap for optical sensor packages
- Patent number 10,355,146
- Issue date Jul 16, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Proximity detector device with interconnect layers and related methods
- Patent number 10,326,039
- Issue date Jun 18, 2019
- STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity detector device with interconnect layers and related methods
- Patent number 10,141,471
- Issue date Nov 27, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor circuit, system, and method
- Patent number 9,640,574
- Issue date May 2, 2017
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adhesive dam
- Patent number 9,025,339
- Issue date May 5, 2015
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lens alignment apparatus and method
- Patent number 9,019,636
- Issue date Apr 28, 2015
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G02 - OPTICS
Information Patent Grant
Camera module including an image sensor and a laterally adjacent su...
- Patent number 8,934,052
- Issue date Jan 13, 2015
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flip-chip fan-out wafer level package for package-on-package applic...
- Patent number 8,884,422
- Issue date Nov 11, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method using composite material as a base
- Patent number 8,502,367
- Issue date Aug 6, 2013
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package for an optical sensor and method of man...
- Patent number 8,466,997
- Issue date Jun 18, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip Scale Package structure with can attachment
- Patent number 8,389,335
- Issue date Mar 5, 2013
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package with coplanarity controlling f...
- Patent number 8,278,146
- Issue date Oct 2, 2012
- STMicroelectronics Asia Pacific PTE Ltd.
- Jing-en Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure with can attachment
- Patent number 8,164,179
- Issue date Apr 24, 2012
- STMicroelectronics Asia Pacific PTE Ltd-Singapore
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a stiffening member supporting a thermal...
- Patent number 8,013,438
- Issue date Sep 6, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step cavity for enhanced drop test performance in ball grid array p...
- Patent number 7,956,475
- Issue date Jun 7, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with position member
- Patent number 7,919,361
- Issue date Apr 5, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with position member
- Patent number 7,745,945
- Issue date Jun 29, 2010
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE
- Publication number 20240332143
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240290807
- Publication date Aug 29, 2024
- STMicroelectronics International N.V.
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240282881
- Publication date Aug 22, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SIZE PACKAGE AND SYSTEM
- Publication number 20240128203
- Publication date Apr 18, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH ENCAPSULANT IS BETWEEN AND SEPARATES SU...
- Publication number 20240036169
- Publication date Feb 1, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES
- Publication number 20230411332
- Publication date Dec 21, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
- Publication number 20230245992
- Publication date Aug 3, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS
- Publication number 20230197545
- Publication date Jun 22, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20230071048
- Publication date Mar 9, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
- Publication number 20230030627
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW COST WAFER LEVEL PACKAGES AND SILICON
- Publication number 20230032887
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE INCLUDING A SENSOR DIE
- Publication number 20230029799
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SENSOR PACKAGES
- Publication number 20220352133
- Publication date Nov 3, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...
- Publication number 20220319963
- Publication date Oct 6, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING HAVING REDISTRIBUTION LAYER FORMED UTILIZING...
- Publication number 20220285256
- Publication date Sep 8, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT
- Publication number 20220199582
- Publication date Jun 23, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND METHOD OF MAKING AN OPTICAL SENSOR PACKAGE
- Publication number 20220189788
- Publication date Jun 16, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH POLYMER PILLARS AND RAISED PORTIONS
- Publication number 20220165699
- Publication date May 26, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR
- Publication number 20210395077
- Publication date Dec 23, 2021
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20210399157
- Publication date Dec 23, 2021
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20210080547
- Publication date Mar 18, 2021
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES
- Publication number 20200395324
- Publication date Dec 17, 2020
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS
- Publication number 20200381320
- Publication date Dec 3, 2020
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS
- Publication number 20190058076
- Publication date Feb 21, 2019
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Application
GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES
- Publication number 20180331236
- Publication date Nov 15, 2018
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
- Publication number 20180122728
- Publication date May 3, 2018
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS
- Publication number 20170330989
- Publication date Nov 16, 2017
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Application
ADHESIVE DAM
- Publication number 20130170164
- Publication date Jul 4, 2013
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT
- Publication number 20120178213
- Publication date Jul 12, 2012
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CIRCUIT, SYSTEM, AND METHOD
- Publication number 20120168888
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- JING-EN LUAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Jing-En LUAN

Person

Patents Grantslast 30 patents

Semiconductor device with a dielectric between portions

Optical sensor package and method of making an optical sensor package

Embedded wafer level optical sensor packaging

Molded proximity sensor

Optical sensor package with encapsulant is between and separates su...

Wafer level chip scale package having varying thicknesses

Semiconductor device with a dielectric between portions

Glue bleeding prevention cap for optical sensor packages

Proximity detector device with interconnect layers and related methods

Proximity detector device with interconnect layers and related methods

Image sensor circuit, system, and method

Adhesive dam

Lens alignment apparatus and method

Camera module including an image sensor and a laterally adjacent su...

Flip-chip fan-out wafer level package for package-on-package applic...

Wafer-level packaging method using composite material as a base

Fan-out wafer level package for an optical sensor and method of man...

Chip Scale Package structure with can attachment

Manufacturing method of chip package with coplanarity controlling f...

Chip scale package structure with can attachment

Semiconductor package with a stiffening member supporting a thermal...

Step cavity for enhanced drop test performance in ball grid array p...

Semiconductor package with position member

Semiconductor package with position member

Patents Applicationslast 30 patents

HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE

SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE

EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING

CHIP SIZE PACKAGE AND SYSTEM

OPTICAL SENSOR PACKAGE WITH ENCAPSULANT IS BETWEEN AND SEPARATES SU...

WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS

MOLDED PROXIMITY SENSOR

SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

LOW COST WAFER LEVEL PACKAGES AND SILICON

SENSOR PACKAGE INCLUDING A SENSOR DIE

LOW PROFILE SENSOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...

WAFER LEVEL PACKAGING HAVING REDISTRIBUTION LAYER FORMED UTILIZING...

STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT

OPTICAL SENSOR PACKAGE AND METHOD OF MAKING AN OPTICAL SENSOR PACKAGE

PACKAGE WITH POLYMER PILLARS AND RAISED PORTIONS

WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR

EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING

OPTICAL SENSOR PACKAGE

WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES

SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS

PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS

GLUE BLEEDING PREVENTION CAP FOR OPTICAL SENSOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME

PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS

ADHESIVE DAM

CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT

IMAGE SENSOR CIRCUIT, SYSTEM, AND METHOD