Jing Li Yuan

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Stacked wafer level package and method of manufacturing the same
- Patent number 8,704,350
- Issue date Apr 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 7,670,878
- Issue date Mar 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jing Li Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer-level image sensor module, method of manufacturing the same a...
- Publication number 20110012220
- Publication date Jan 20, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked wafer level package and method of manufacturing the same
- Publication number 20100117218
- Publication date May 13, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level image sensor module, method of manufacturing the same,...
- Publication number 20090085134
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor package
- Publication number 20080286904
- Publication date Nov 20, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jing Li Yuan
- H03 - BASIC ELECTRONIC CIRCUITRY