Jing Qi

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Schaumburg, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Area-array device assembly with pre-applied underfill layers on pri...
- Patent number 6,821,878
- Issue date Nov 23, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Janice Danvir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly with thin underfill and thick solder mask
- Patent number 6,774,497
- Issue date Aug 10, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Jing Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer coating and singulation method
- Patent number 6,649,445
- Issue date Nov 18, 2003
- Motorola, Inc.
- Jing Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device exhibiting enhanced pattern recognition when i...
- Patent number 6,650,022
- Issue date Nov 18, 2003
- Motorola, Inc.
- Jing Qi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Communicating Information Using an Existing Light Source of an Elec...
- Publication number 20080253202
- Publication date Oct 16, 2008
- MOTOROLA, INC.
- Huinan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Area-array device assembly with pre-applied underfill layers on pri...
- Publication number 20040169275
- Publication date Sep 2, 2004
- MOTOROLA, INC.
- Janice Danvir
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package device and method
- Publication number 20030132513
- Publication date Jul 17, 2003
- MOTOROLA, INC.
- Marc Chason
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...