Jing-Ye Juang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
- Patent number 11,145,619
- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structure and method for fabricating the same
- Patent number 9,184,153
- Issue date Nov 10, 2015
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level molding structure
- Patent number 8,384,215
- Issue date Feb 26, 2013
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-UNDERFILL ENCAPSULATION FOR PACKAGING AND METHODS OF FORMING T...
- Publication number 20230395479
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20230307337
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130234320
- Publication date Sep 12, 2013
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MOLDING STRUCTURE
- Publication number 20120168933
- Publication date Jul 5, 2012
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20100207266
- Publication date Aug 19, 2010
- Industrial Technology Research Institute
- Tao-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS

Jing-Ye Juang

Person

Patents Grantslast 30 patents

Electrical connecting structure having nano-twins copper

Electrical connecting structure having nano-twins copper and method...

Chip stack structure and method for fabricating the same

Wafer level molding structure

Patents Applicationslast 30 patents

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

DUAL-UNDERFILL ENCAPSULATION FOR PACKAGING AND METHODS OF FORMING T...

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME

WAFER LEVEL MOLDING STRUCTURE

CHIP PACKAGE STRUCTURE