JINGANG WU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and fabrication method
- Patent number 9,177,913
- Issue date Nov 3, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 8,513,075
- Issue date Aug 20, 2013
- Semiconductor Manufacturing International Corporation
- Yonggen He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for a DRAM capacitor having low depletion ratio
- Patent number 8,426,286
- Issue date Apr 23, 2013
- Semiconductor Manufacturing International (Shanghai) Corporation
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for direct etching
- Patent number 7,534,711
- Issue date May 19, 2009
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low energy dose monitoring of implanter using implanted wafers
- Patent number 7,259,027
- Issue date Aug 21, 2007
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring low temperature rapid thermal anneal process using impla...
- Patent number 6,962,884
- Issue date Nov 8, 2005
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20160020215
- Publication date Jan 21, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- JINGANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD
- Publication number 20140117491
- Publication date May 1, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- JINGANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130032887
- Publication date Feb 7, 2013
- Semiconductor Manufacturing International (Beijing) Corporation
- Yonggen HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO
- Publication number 20110254127
- Publication date Oct 20, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DIRECT ETCHING
- Publication number 20080146030
- Publication date Jun 19, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low energy dose monitoring of implanter using implanted wafers
- Publication number 20050142671
- Publication date Jun 30, 2005
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring low temperature rapid thermal anneal process using impla...
- Publication number 20050124080
- Publication date Jun 9, 2005
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure and fabrication method

Method for manufacturing a semiconductor device

Method and device for a DRAM capacitor having low depletion ratio

System and method for direct etching

Low energy dose monitoring of implanter using implanted wafers

Monitoring low temperature rapid thermal anneal process using impla...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD AND DEVICE FOR A DRAM CAPACITOR HAVING LOW DEPLETION RATIO

SYSTEM AND METHOD FOR DIRECT ETCHING

Low energy dose monitoring of implanter using implanted wafers

Monitoring low temperature rapid thermal anneal process using impla...