Jingbin Feng

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 12,157,950
- Issue date Dec 3, 2024
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 11,512,408
- Issue date Nov 29, 2022
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,401,623
- Issue date Aug 2, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High flow multi-way piston valve for deposition systems
- Patent number 10,969,036
- Issue date Apr 6, 2021
- Lam Research Corporation
- James Isaac Fortner
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 10,927,475
- Issue date Feb 23, 2021
- Lam Research Corporation
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform flow behavior in an electroplating cell
- Patent number 10,711,364
- Issue date Jul 14, 2020
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 10,435,807
- Issue date Oct 8, 2019
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 10,351,968
- Issue date Jul 16, 2019
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 10,053,792
- Issue date Aug 21, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 9,988,734
- Issue date Jun 5, 2018
- Lam Research Corporation
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for uniform flow behavior in an electroplating cell
- Patent number 9,945,044
- Issue date Apr 17, 2018
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte flow dynamics for uniform electroplating
- Patent number 9,816,194
- Issue date Nov 14, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrofill vacuum plating cell
- Patent number 9,677,188
- Issue date Jun 13, 2017
- Novellus Systems, Inc.
- R. Marshall Stowell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 9,512,538
- Issue date Dec 6, 2016
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 9,340,893
- Issue date May 17, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 9,309,604
- Issue date Apr 12, 2016
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 9,228,270
- Issue date Jan 5, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Front referenced anode
- Patent number 9,028,657
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,540,857
- Issue date Sep 24, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,475,636
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus with vented electrolyte manifold
- Patent number 8,475,637
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,475,644
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Segmented electroplating anode and anode segment
- Patent number D668211
- Issue date Oct 2, 2012
- Novellus Systems, Inc.
- Jingbin Feng
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,262,871
- Issue date Sep 11, 2012
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless plating-liquid system
- Patent number 8,257,781
- Issue date Sep 4, 2012
- Novellus Systems, Inc.
- Eric G. Webb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetically actuated chuck for edge bevel removal
- Patent number 8,172,646
- Issue date May 8, 2012
- Novellus Systems, Inc.
- Jingbin Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Small-volume electroless plating cell
- Patent number 7,690,324
- Issue date Apr 6, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer chuck for use in edge bevel removal of copper from silicon wa...
- Patent number 6,967,174
- Issue date Nov 22, 2005
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for airflow and heat management in electroles...
- Patent number 6,713,122
- Issue date Mar 30, 2004
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20230076493
- Publication date Mar 9, 2023
- Novellus Systems, Inc.
- Jingbin FENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20220333267
- Publication date Oct 20, 2022
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS
- Publication number 20210366768
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Zhian HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20210130976
- Publication date May 6, 2021
- LAM RESEARCH CORPORATION
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FLOW MULTI-WAY PISTON VALVE FOR DEPOSITION SYSTEMS
- Publication number 20190368630
- Publication date Dec 5, 2019
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20190127872
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20180347065
- Publication date Dec 6, 2018
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL
- Publication number 20180202062
- Publication date Jul 19, 2018
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING
- Publication number 20160273119
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20160222541
- Publication date Aug 4, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20160186355
- Publication date Jun 30, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20160115615
- Publication date Apr 28, 2016
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20150218726
- Publication date Aug 6, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20150211144
- Publication date Jul 30, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20150191843
- Publication date Jul 9, 2015
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL
- Publication number 20150122638
- Publication date May 7, 2015
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROFILL VACUUM PLATING CELL
- Publication number 20140097088
- Publication date Apr 10, 2014
- Novellus Systems, Inc.
- R. Marshall Stowell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING
- Publication number 20130327650
- Publication date Dec 12, 2013
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20130062197
- Publication date Mar 14, 2013
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20130042454
- Publication date Feb 21, 2013
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20120061246
- Publication date Mar 15, 2012
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL
- Publication number 20100219920
- Publication date Sep 2, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating Apparatus with Vented Electrolyte Manifold
- Publication number 20100147679
- Publication date Jun 17, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING
- Publication number 20100116672
- Publication date May 13, 2010
- Novellus Systems, Inc.
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING
- Publication number 20100044236
- Publication date Feb 25, 2010
- Novellus Systems, Inc.
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Jingbin Feng

Person

Patents Grantslast 30 patents

Lipseals and contact elements for semiconductor electroplating appa...

Controlling plating electrolyte concentration on an electrochemical...

Lipseals and contact elements for semiconductor electroplating appa...

Controlling plating electrolyte concentration on an electrochemical...

High flow multi-way piston valve for deposition systems

Controlling plating electrolyte concentration on an electrochemical...

Uniform flow behavior in an electroplating cell

Lipseals and contact elements for semiconductor electroplating appa...

Front referenced anode

Plating cup with contoured cup bottom

Lipseals and contact elements for semiconductor electroplating appa...

Method for uniform flow behavior in an electroplating cell

Control of electrolyte flow dynamics for uniform electroplating

Electrofill vacuum plating cell

Plating cup with contoured cup bottom

Front referenced anode

Method and apparatus for electroplating

Lipseals and contact elements for semiconductor electroplating appa...

Front referenced anode

Plating method and apparatus with multiple internally irrigated cha...

Method and apparatus for electroplating

Electroplating apparatus with vented electrolyte manifold

Method and apparatus for electroplating

Segmented electroplating anode and anode segment

Plating method and apparatus with multiple internally irrigated cha...

Electroless plating-liquid system

Magnetically actuated chuck for edge bevel removal

Small-volume electroless plating cell

Wafer chuck for use in edge bevel removal of copper from silicon wa...

Methods and apparatus for airflow and heat management in electroles...

Patents Applicationslast 30 patents

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

HIGH FLOW MULTI-WAY PISTON VALVE FOR DEPOSITION SYSTEMS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL

CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

FRONT REFERENCED ANODE

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

PLATING CUP WITH CONTOURED CUP BOTTOM

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

FRONT REFERENCED ANODE

PLATING CUP WITH CONTOURED CUP BOTTOM

METHOD FOR UNIFORM FLOW BEHAVIOR IN AN ELECTROPLATING CELL

ELECTROFILL VACUUM PLATING CELL

METHOD AND APPARATUS FOR ELECTROPLATING

PLATING CUP WITH CONTOURED CUP BOTTOM

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

FRONT REFERENCED ANODE

MAGNETICALLY ACTUATED CHUCK FOR EDGE BEVEL REMOVAL

Electroplating Apparatus with Vented Electrolyte Manifold

METHOD AND APPARATUS FOR ELECTROPLATING

METHOD AND APPARATUS FOR ELECTROPLATING