Jinghua Zhu

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,688,704
- Issue date Jun 27, 2023
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,233,025
- Issue date Jan 25, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous 3D chip stack for a mobile processor
- Patent number 10,658,335
- Issue date May 19, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20220148988
- Publication date May 12, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS 3D CHIP STACK FOR A MOBILE PROCESSOR
- Publication number 20180366442
- Publication date Dec 20, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20180350762
- Publication date Dec 6, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS