Jingli Yuan

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Die package including encapsulated die and method of manufacturing...
- Patent number 8,334,602
- Issue date Dec 18, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a dual face package
- Patent number 8,273,660
- Issue date Sep 25, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual face package having resin insulating layer
- Patent number 8,093,705
- Issue date Jan 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package fabrication method
- Patent number 7,696,004
- Issue date Apr 13, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING...
- Publication number 20130056141
- Publication date Mar 7, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a dual face package
- Publication number 20110129994
- Publication date Jun 2, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING...
- Publication number 20100320624
- Publication date Dec 23, 2010
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual face package and method of manufacturing the same
- Publication number 20100102426
- Publication date Apr 29, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball attachment jig and method for manufacturing semiconduct...
- Publication number 20090253259
- Publication date Oct 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090166859
- Publication date Jul 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090166862
- Publication date Jul 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module at wafer level, method of manufacturing the sam...
- Publication number 20090014827
- Publication date Jan 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hyun Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module package and method of manufacturing the same
- Publication number 20080304821
- Publication date Dec 11, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Won Kyu Jeung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level package fabrication method
- Publication number 20080299706
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Camera module package
- Publication number 20080296577
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package of image sensor and method for manufacturing th...
- Publication number 20080296714
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Jingli Yuan

Person

Patents Grantslast 30 patents

Die package including encapsulated die and method of manufacturing...

Method of manufacturing a dual face package

Dual face package having resin insulating layer

Wafer level package fabrication method

Patents Applicationslast 30 patents

DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING...

Method of manufacturing a dual face package

DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING...

Dual face package and method of manufacturing the same

Solder ball attachment jig and method for manufacturing semiconduct...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Image sensor module at wafer level, method of manufacturing the sam...

Camera module package and method of manufacturing the same

Wafer level package fabrication method

Camera module package

Wafer level package of image sensor and method for manufacturing th...