JINGLING WANG

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device
- Patent number 11,127,621
- Issue date Sep 21, 2021
- United Microelectronics Corp.
- Ji Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20210134653
- Publication date May 6, 2021
- UNITED MICROELECTRONICS CORP.
- JI FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ISOLATING STRUCTURE AND THROUGH SILICON VIA
- Publication number 20140357050
- Publication date Dec 4, 2014
- JI FENG
- H01 - BASIC ELECTRIC ELEMENTS