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Jingshi CHI

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 11,420,294
    • Issue date Aug 23, 2022
    • Disco Corporation
    • Jingshi Chi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP MANUFACTURING METHOD
    • Publication number 20240100632
    • Publication date Mar 28, 2024
    • Disco Corporation
    • Jingshi CHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190160597
    • Publication date May 30, 2019
    • Disco Corporation
    • Jingshi CHI
    • B28 - WORKING CEMENT, CLAY, OR STONE