JinGwan Kim

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Compartment shielding with metal frame and cap
- Patent number 11,776,861
- Issue date Oct 3, 2023
- STATS ChipPAC Pte. Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 9,401,347
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 9,379,064
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 9,048,209
- Issue date Jun 2, 2015
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,937,371
- Issue date Jan 20, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming partially-etched conduct...
- Patent number 8,932,908
- Issue date Jan 13, 2015
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming Fo-WLCSP having conducti...
- Patent number 8,836,114
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,531,012
- Issue date Sep 10, 2013
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partially-etched conductive layer recesse...
- Patent number 8,502,392
- Issue date Aug 6, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnects and...
- Patent number 8,476,135
- Issue date Jul 2, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,432,028
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming Fo-WLCSP having conducti...
- Patent number 8,343,810
- Issue date Jan 1, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with embedded conductive struct...
- Patent number 8,310,038
- Issue date Nov 13, 2012
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming partially-etched conductive layer recessed within...
- Patent number 8,288,202
- Issue date Oct 16, 2012
- STATS ChiPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 8,003,496
- Issue date Aug 23, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system
- Patent number 8,004,093
- Issue date Aug 23, 2011
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230402332
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230071960
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20150228590
- Publication date Aug 13, 2015
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Over a...
- Publication number 20150137334
- Publication date May 21, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20130292804
- Publication date Nov 7, 2013
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20130249090
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20130075919
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120326303
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...
- Publication number 20120299168
- Publication date Nov 29, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCT...
- Publication number 20120241967
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20120241936
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120126416
- Publication date May 24, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20120038053
- Publication date Feb 16, 2012
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20110278705
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20110095403
- Publication date Apr 28, 2011
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20110037165
- Publication date Feb 17, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
- Publication number 20100025835
- Publication date Feb 4, 2010
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

JinGwan Kim

Person

Patents Grantslast 30 patents

Compartment shielding with metal frame and cap

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of mounting semiconductor die to he...

Semiconductor device and method of mounting semiconductor die to he...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of forming partially-etched conduct...

Semiconductor device and method of forming Fo-WLCSP having conducti...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device with partially-etched conductive layer recesse...

Integrated circuit packaging system with vertical interconnects and...

Integrated circuit packaging system with package-on-package and met...

Semiconductor device and method of forming Fo-WLCSP having conducti...

Integrated circuit packaging system with embedded conductive struct...

Method of forming partially-etched conductive layer recessed within...

Semiconductor device and method of mounting semiconductor die to he...

Integrated circuit package stacking system

Patents Applicationslast 30 patents

Compartment Shielding With Metal Frame and Cap

Compartment Shielding With Metal Frame and Cap

Semiconductor Device and Method of Mounting Semiconductor Die to He...

Semiconductor Device and Method of Forming a Shielding Layer Over a...

Semiconductor Device and Method of Forming a Shielding Layer over a...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCT...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...

Semiconductor Device and Method of Forming Partially-Etched Conduct...

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

Semiconductor Device and Method of Mounting Semiconductor Die to He...

Semiconductor Device and Method of Forming a Shielding Layer over a...

Semiconductor Device and Method of Mounting Semiconductor Die to He...

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM