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Jingxun FANG
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Method for avoiding IL regrown in a HKMG process
Patent number
10,651,285
Issue date
May 12, 2020
Shanghai Huali Microelectronics Corporation
Yingming Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming cobalt barrier layer and metal interconnection p...
Patent number
9,449,872
Issue date
Sep 20, 2016
Shanghai Huali Microelectronics Corporation
Tong Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming strained source and drain regions in a P-type fin...
Patent number
8,987,101
Issue date
Mar 24, 2015
Shanghai Huali Microelectronics Corporation
Yi Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming Cu interconnects
Patent number
8,772,157
Issue date
Jul 8, 2014
Shanghai Huali Microelectronics Corporation
Jingxun Fang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method for improving surface planarity after tungsten c...
Patent number
8,673,768
Issue date
Mar 18, 2014
Shanghai Huali Microelectronics Corporation
Jingxun Fang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR AVOIDING IL REGROWN IN A HKMG PROCESS
Publication number
20180175157
Publication date
Jun 21, 2018
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Yingming Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING COBALT BARRIER LAYER AND METAL INTERCONNECTION P...
Publication number
20160300758
Publication date
Oct 13, 2016
Shanghai Huali Microelectronics Corporation
Tong Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING STRAINED SOURCE AND DRAIN REGIONS IN A P-TYPE FIN...
Publication number
20140357041
Publication date
Dec 4, 2014
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Yi Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SIGMA-SHAPED TRENCH
Publication number
20140322879
Publication date
Oct 30, 2014
Shanghai Huali Microelectronics Corproation
Quanbo LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING CU INTERCONNECTS
Publication number
20140127900
Publication date
May 8, 2014
Jingxun FANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD FOR IMPROVING SURFACE PLANARITY AFTER TUNGSTEN C...
Publication number
20130224949
Publication date
Aug 29, 2013
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Jingxun FANG
H01 - BASIC ELECTRIC ELEMENTS