Jingyi Bai

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Back side illuminated CMOS image sensor arrays
- Patent number 10,741,602
- Issue date Aug 11, 2020
- Cista System Corp.
- Hirofumi Komori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illuminated CMOS image sensor arrays
- Patent number 9,876,045
- Issue date Jan 23, 2018
- Cista System Corp.
- Hirofumi Komori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Global shutter pixel with improved efficiency
- Patent number 8,878,264
- Issue date Nov 4, 2014
- Aptina Imaging Corporation
- Sergey Velichko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 8,673,787
- Issue date Mar 18, 2014
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit having pitch reduced patterns relative to photoi...
- Patent number 8,598,632
- Issue date Dec 3, 2013
- Round Rock Research LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 8,207,576
- Issue date Jun 26, 2012
- Round Rock Research, LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of photoresist scumming
- Patent number 8,129,093
- Issue date Mar 6, 2012
- Micron Technology, Inc.
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multiple deposition for integration of spacers in pitch multiplicat...
- Patent number 8,123,968
- Issue date Feb 28, 2012
- Round Rock Research, LLC
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 8,119,535
- Issue date Feb 21, 2012
- Round Rock Research, LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 8,048,812
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 7,985,692
- Issue date Jul 26, 2011
- Micron Technology, Inc.
- Gurtej S. Sandhu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multiple deposition for integration of spacers in pitch multiplicat...
- Patent number 7,884,022
- Issue date Feb 8, 2011
- Round Rock Research, LLC
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 7,718,540
- Issue date May 18, 2010
- Round Rock Research, LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of photoresist scumming
- Patent number 7,704,673
- Issue date Apr 27, 2010
- Micron Technology, Inc.
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 7,651,951
- Issue date Jan 26, 2010
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple deposition for integration of spacers in pitch multiplicat...
- Patent number 7,390,746
- Issue date Jun 24, 2008
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce charge buildup during high aspect ratio contact etch
- Patent number 7,344,975
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of photoresist scumming
- Patent number 7,270,917
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods for filling high aspect ratio trenches in semiconductor layers
- Patent number 7,259,079
- Issue date Aug 21, 2007
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduced patterns relative to photolithography features
- Patent number 7,253,118
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of photoresist scumming
- Patent number 7,175,944
- Issue date Feb 13, 2007
- Micron Technology, Inc.
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods for filling high aspect ratio trenches in semiconductor layers
- Patent number 6,982,207
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST KEY TRANSISTOR FOR DEEP TRENCH ISOLATION DEPTH DETECTION
- Publication number 20240071846
- Publication date Feb 29, 2024
- Cista System Corp.
- Jingyi BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CENTRALLY SYMMETRIC VERTICAL TRANSFER GATE
- Publication number 20240072094
- Publication date Feb 29, 2024
- Cista System Corp.
- Jingyi BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED CMOS IMAGE SENSOR ARRAYS
- Publication number 20180097025
- Publication date Apr 5, 2018
- CISTA SYSTEM CORP.
- HIROFUMI KOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED CMOS IMAGE SENSOR ARRAYS
- Publication number 20160329367
- Publication date Nov 10, 2016
- CISTA SYSTEM CORP.
- HIROFUMI KOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLOBAL SHUTTER PIXEL WITH IMPROVED EFFICIENCY
- Publication number 20120273854
- Publication date Nov 1, 2012
- APTINA IMAGING CORPORATION
- Sergey Velichko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having Pitch Reduced Patterns Relative To Photol...
- Publication number 20120256309
- Publication date Oct 11, 2012
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Reduce Charge Buildup During High Aspect Ratio Contact Etch
- Publication number 20110250759
- Publication date Oct 13, 2011
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...
- Publication number 20110117743
- Publication date May 19, 2011
- ROUND ROCK RESEARCH, LLC
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES
- Publication number 20100210111
- Publication date Aug 19, 2010
- ROUND ROCK RESEARCH, LLC
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF PHOTORESIST SCUMMING
- Publication number 20100196807
- Publication date Aug 5, 2010
- Micron Technology, Inc.
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES
- Publication number 20100092891
- Publication date Apr 15, 2010
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...
- Publication number 20080149593
- Publication date Jun 26, 2008
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE CHARGE BUILDUP DURING HIGH ASPECT RATIO CONTACT ETCH
- Publication number 20080128389
- Publication date Jun 5, 2008
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF PHOTORESIST SCUMMING
- Publication number 20080008942
- Publication date Jan 10, 2008
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES
- Publication number 20070161251
- Publication date Jul 12, 2007
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES
- Publication number 20070138526
- Publication date Jun 21, 2007
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES
- Publication number 20070128856
- Publication date Jun 7, 2007
- Micron Technology, Inc.
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...
- Publication number 20070117310
- Publication date May 24, 2007
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple deposition for integration of spacers in pitch multiplicat...
- Publication number 20070049040
- Publication date Mar 1, 2007
- MICRON TECHNOLOGY, INC., a Corporation
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce charge buildup during high aspect ratio contact etch
- Publication number 20070049018
- Publication date Mar 1, 2007
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prevention of photoresist scumming
- Publication number 20060240340
- Publication date Oct 26, 2006
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Pitch reduced patterns relative to photolithography features
- Publication number 20060211260
- Publication date Sep 21, 2006
- Luan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prevention of photoresist scumming
- Publication number 20060046161
- Publication date Mar 2, 2006
- Zhiping Yin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods for filling high aspect ratio trenches in semiconductor layers
- Publication number 20050158965
- Publication date Jul 21, 2005
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for filling high aspect ratio trenches in semiconductor layers
- Publication number 20050009291
- Publication date Jan 13, 2005
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Back side illuminated CMOS image sensor arrays

Back side illuminated CMOS image sensor arrays

Global shutter pixel with improved efficiency

Method to reduce charge buildup during high aspect ratio contact etch

Integrated circuit having pitch reduced patterns relative to photoi...

Pitch reduced patterns relative to photolithography features

Prevention of photoresist scumming

Multiple deposition for integration of spacers in pitch multiplicat...

Pitch reduced patterns relative to photolithography features

Pitch reduced patterns relative to photolithography features

Method to reduce charge buildup during high aspect ratio contact etch

Multiple deposition for integration of spacers in pitch multiplicat...

Pitch reduced patterns relative to photolithography features

Prevention of photoresist scumming

Pitch reduced patterns relative to photolithography features

Multiple deposition for integration of spacers in pitch multiplicat...

Method to reduce charge buildup during high aspect ratio contact etch

Prevention of photoresist scumming

Methods for filling high aspect ratio trenches in semiconductor layers

Pitch reduced patterns relative to photolithography features

Prevention of photoresist scumming

Methods for filling high aspect ratio trenches in semiconductor layers

Patents Applicationslast 30 patents

TEST KEY TRANSISTOR FOR DEEP TRENCH ISOLATION DEPTH DETECTION

CENTRALLY SYMMETRIC VERTICAL TRANSFER GATE

BACK SIDE ILLUMINATED CMOS IMAGE SENSOR ARRAYS

BACK SIDE ILLUMINATED CMOS IMAGE SENSOR ARRAYS

GLOBAL SHUTTER PIXEL WITH IMPROVED EFFICIENCY

Integrated Circuit Having Pitch Reduced Patterns Relative To Photol...

Method to Reduce Charge Buildup During High Aspect Ratio Contact Etch

MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...

PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES

PREVENTION OF PHOTORESIST SCUMMING

PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES

MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...

METHOD TO REDUCE CHARGE BUILDUP DURING HIGH ASPECT RATIO CONTACT ETCH

PREVENTION OF PHOTORESIST SCUMMING

PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES

PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES

PITCH REDUCED PATTERNS RELATIVE TO PHOTOLITHOGRAPHY FEATURES

MULTIPLE DEPOSITION FOR INTEGRATION OF SPACERS IN PITCH MULTIPLICAT...

Multiple deposition for integration of spacers in pitch multiplicat...

Method to reduce charge buildup during high aspect ratio contact etch

Prevention of photoresist scumming

Pitch reduced patterns relative to photolithography features

Prevention of photoresist scumming

Methods for filling high aspect ratio trenches in semiconductor layers

Methods for filling high aspect ratio trenches in semiconductor layers