JINGYU KIM

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package substrates
- Patent number 10,256,181
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,032,706
- Issue date Jul 24, 2018
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing semiconductor package
- Patent number 9,474,145
- Issue date Oct 18, 2016
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including gap in interconnection terminals a...
- Patent number 9,378,987
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Jungwoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20180315698
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20170077041
- Publication date Mar 16, 2017
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING GAP IN INTERCONNECTION TERMINALS A...
- Publication number 20160043057
- Publication date Feb 11, 2016
- JUNGWOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20160013126
- Publication date Jan 14, 2016
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20150382443
- Publication date Dec 31, 2015
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS