Jinho An

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,021,034
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Solji Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,978,688
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,476,176
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a TSV, a front-side bumping pad, and a...
- Patent number 9,806,004
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a redistribution area
- Patent number 9,799,619
- Issue date Oct 24, 2017
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240312923
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
- Publication number 20230111136
- Publication date Apr 13, 2023
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220059466
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
- Publication number 20210335688
- Publication date Oct 28, 2021
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210035878
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A REDISTRIBUTION AREA
- Publication number 20170053882
- Publication date Feb 23, 2017
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A TSV, A FRONT-SIDE BUMPING PAD, AND A...
- Publication number 20160155686
- Publication date Jun 2, 2016
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device having via protective layer

Semiconductor device having via protective layer

Semiconductor devices having a TSV, a front-side bumping pad, and a...

Electronic device having a redistribution area

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE HAVING A REDISTRIBUTION AREA

SEMICONDUCTOR DEVICES HAVING A TSV, A FRONT-SIDE BUMPING PAD, AND A...