Jinkuk BAE

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,923,292
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,024,575
- Issue date Jun 1, 2021
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387005
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Junhyeok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210305114
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- CHANHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210257294
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Jinkuk BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200105666
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Jinkuk BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200105702
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Chanho LEE
- H01 - BASIC ELECTRIC ELEMENTS