Jinmei Liu

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,222,790
- Issue date Jan 11, 2022
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead reduction for improved creepage distance
- Patent number 10,734,327
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having stacked die and method for therefor
- Patent number 10,446,476
- Issue date Oct 15, 2019
- NXP USA, INC.
- Leo M. Higgins
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20220093416
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR REMOVAL FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20210202267
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE
- Publication number 20200203289
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20190088576
- Publication date Mar 21, 2019
- NXP USA, Inc.
- LEO M. HIGGINS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE