Jinseong Kim

Follow

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor interposer layer (CIL) chiplet design with conformal die...
- Patent number 11,658,103
- Issue date May 23, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensiona...
- Patent number 11,158,590
- Issue date Oct 26, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING INTERPOSER F...
- Publication number 20230059431
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Krishna VEMURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING STACKED INTEGRATED DEVICES WITH OVERHANG
- Publication number 20230019333
- Publication date Jan 19, 2023
- QUALCOMM Incorporated
- Krishna VEMURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR INTERPOSER LAYER (CIL) CHIPLET DESIGN WITH CONFORMAL DIE...
- Publication number 20220084922
- Publication date Mar 17, 2022
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR INTERPOSER LAYER (CIL) IN A DIE-TO-WAFER THREE-DIMENSIONA...
- Publication number 20210335738
- Publication date Oct 28, 2021
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS