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Jinsu Kwon
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Campbell, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Interconnection element with posts formed by plating
Patent number
9,282,640
Issue date
Mar 8, 2016
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip interconnection with double post
Patent number
8,884,448
Issue date
Nov 11, 2014
Tessera, Inc.
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip interconnection with double post
Patent number
8,558,379
Issue date
Oct 15, 2013
Tessera, Inc.
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating an interconnection element having conductive...
Patent number
8,505,199
Issue date
Aug 13, 2013
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
FLIP CHIP INTERCONNECTION WITH DOUBLE POST
Publication number
20150054153
Publication date
Feb 26, 2015
Tessera, Inc.
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING
Publication number
20130286619
Publication date
Oct 31, 2013
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP INTERCONNECTION WITH DOUBLE POST
Publication number
20110074027
Publication date
Mar 31, 2011
Tessera, Inc.
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection element with posts formed by plating
Publication number
20090145645
Publication date
Jun 11, 2009
Tessera, Inc.
Jinsu Kwon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip Chip Interconnection with double post
Publication number
20090146303
Publication date
Jun 11, 2009
Tessera, Inc.
Jinsu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection element with plated posts formed on mandrel
Publication number
20090148594
Publication date
Jun 11, 2009
Tessera, Inc.
Sean Moran
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR