Jinwoo Choi

Person

Atlanta, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer ceramic electronic package with modulated mesh topology...
- Patent number 11,071,197
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer ceramic electronic package with modulated mesh topology
- Patent number 10,652,998
- Issue date May 12, 2020
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board with routing of a conductor and dielectric st...
- Patent number 10,542,618
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 10,375,820
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 9,955,567
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal amplification using a reference plane with alternating imped...
- Patent number 9,800,231
- Issue date Oct 24, 2017
- International Business Machines Corporation
- Jinwoo Choi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,773,725
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal amplification using a reference plane with alternating imped...
- Patent number 9,654,060
- Issue date May 16, 2017
- International Business Machines Corporation
- Jinwoo Choi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 9,548,769
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Kevin J. Bills
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High speed differential wiring in glass ceramic MCMS
- Patent number 9,232,645
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High speed differential wiring in glass ceramic MCMS
- Patent number 9,232,646
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,060,428
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mesh planes with alternating spaces for multi-layered ceramic packages
- Patent number 9,053,282
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corles multi-layer circuit substrate with minimized pad capacitance
- Patent number 8,975,525
- Issue date Mar 10, 2015
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 8,927,879
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mesh planes with alternating spaces for multi-layered ceramic packages
- Patent number 8,791,371
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,743,558
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for making high-speed ceramic modules with hybrid referencin...
- Patent number 8,683,413
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,645,889
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Space solution search
- Patent number 8,572,004
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical design space exploration
- Patent number 8,453,081
- Issue date May 28, 2013
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 8,389,870
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced wiring requirements with signal slope manipulation
- Patent number 8,358,509
- Issue date Jan 22, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High-speed ceramic modules with hybrid referencing scheme for impro...
- Patent number 8,339,803
- Issue date Dec 25, 2012
- International Business Machine Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,288,657
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Swarm intelligence for electrical design space modeling and optimiz...
- Patent number 8,276,106
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission cable with spirally wrapped shielding
- Patent number 7,999,185
- Issue date Aug 16, 2011
- International Business Machines Corporation
- Moises Cases
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ultimate noise isolation in high-speed digital systems o...
- Patent number 7,839,654
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed-signal systems with alternating impedance electromagnetic ban...
- Patent number 7,253,788
- Issue date Aug 7, 2007
- Georgia Tech Research Corp.
- Jinwoo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic bandgap structure for isolation in mixed-signal sys...
- Patent number 7,215,301
- Issue date May 8, 2007
- Georgia Tech Research Corporation
- Jinwoo Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC ELECTRONIC PACKAGE WITH MODULATED MESH TOPOLOGY...
- Publication number 20200100356
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC PACKAGE WITH MODULATED MESH TOPOLOGY
- Publication number 20200100355
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed Circuit Board with Routing of a Conductor and Dielectric St...
- Publication number 20200092980
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Yanyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20180213636
- Publication date Jul 26, 2018
- JINWOO CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL AMPLIFICATION USING A REFERENCE PLANE WITH ALTERNATING IMPED...
- Publication number 20170141772
- Publication date May 18, 2017
- International Business Machines Corporation
- JINWOO CHOI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SIGNAL AMPLIFICATION USING A REFERENCE PLANE WITH ALTERNATING IMPED...
- Publication number 20170141742
- Publication date May 18, 2017
- International Business Machines Corporation
- JINWOO CHOI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20160225705
- Publication date Aug 4, 2016
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MESH-PLANE VIAS IN A MULTI-LAYERED PACKAGE
- Publication number 20150170996
- Publication date Jun 18, 2015
- International Business Machines Corporation
- Dulce M. Altabella Lazzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS
- Publication number 20150144382
- Publication date May 28, 2015
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS
- Publication number 20150144252
- Publication date May 28, 2015
- International Business Machines Corporation
- Jinwoo Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20140331482
- Publication date Nov 13, 2014
- JINWOO CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MESH PLANES WITH ALTERNATING SPACES FOR MULTI-LAYERED CERAMIC PACKAGES
- Publication number 20140282346
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reduced Wiring Requirements With Signal Slope Manipulation
- Publication number 20140226749
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...
- Publication number 20130252379
- Publication date Sep 26, 2013
- Wiren D Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESH PLANES WITH ALTERNATING SPACES FOR MULTI-LAYERED CERAMIC PACKAGES
- Publication number 20130133937
- Publication date May 30, 2013
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20130010445
- Publication date Jan 10, 2013
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130008696
- Publication date Jan 10, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130003335
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20120204141
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20120125677
- Publication date May 24, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DESIGN SPACE EXPLORATION
- Publication number 20110289463
- Publication date Nov 24, 2011
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20110222224
- Publication date Sep 15, 2011
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPACE SOLUTION SEARCH
- Publication number 20110161055
- Publication date Jun 30, 2011
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High-Speed Ceramic Modules with Hybrid Referencing Scheme for Impro...
- Publication number 20110132650
- Publication date Jun 9, 2011
- IBM Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20110083888
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVEL...
- Publication number 20110061898
- Publication date Mar 17, 2011
- International Business Machines Corporation
- Bhyrav Mutnury
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Transmission Cable with Spirally Wrapped Shielding
- Publication number 20100294557
- Publication date Nov 25, 2010
- International Business Machines Corporation
- Moises Cases
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWARM INTELLIGENCE FOR ELECTRICAL DESIGN SPACE MODELING AND OPTIMIZ...
- Publication number 20100229131
- Publication date Sep 9, 2010
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION
- Publication number 20100195756
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Kevin J. Bills
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLUTION EFFICIENCY OF GENETIC ALGORITHM APPLICATIONS
- Publication number 20090307636
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Moises Cases
- G06 - COMPUTING CALCULATING COUNTING

Jinwoo Choi

Person

Patents Grantslast 30 patents

Multilayer ceramic electronic package with modulated mesh topology...

Multilayer ceramic electronic package with modulated mesh topology

Printed circuit board with routing of a conductor and dielectric st...

Crosstalk reduction between signal layers in a multilayered package...

Crosstalk reduction between signal layers in a multilayered package...

Signal amplification using a reference plane with alternating imped...

Coreless multi-layer circuit substrate with minimized pad capacitance

Signal amplification using a reference plane with alternating imped...

Reduced wiring requirements with signal slope manipulation

High speed differential wiring in glass ceramic MCMS

High speed differential wiring in glass ceramic MCMS

Coreless multi-layer circuit substrate with minimized pad capacitance

Mesh planes with alternating spaces for multi-layered ceramic packages

Corles multi-layer circuit substrate with minimized pad capacitance

Crosstalk reduction between signal layers in a multilayered package...

Mesh planes with alternating spaces for multi-layered ceramic packages

Reduced wiring requirements with signal slope manipulation

Method for making high-speed ceramic modules with hybrid referencin...

Noise coupling reduction and impedance discontinuity control in hig...

Space solution search

Electrical design space exploration

Coreless multi-layer circuit substrate with minimized pad capacitance

Reduced wiring requirements with signal slope manipulation

High-speed ceramic modules with hybrid referencing scheme for impro...

Noise coupling reduction and impedance discontinuity control in hig...

Swarm intelligence for electrical design space modeling and optimiz...

Transmission cable with spirally wrapped shielding

Method for ultimate noise isolation in high-speed digital systems o...

Mixed-signal systems with alternating impedance electromagnetic ban...

Electromagnetic bandgap structure for isolation in mixed-signal sys...

Patents Applicationslast 30 patents

MULTILAYER CERAMIC ELECTRONIC PACKAGE WITH MODULATED MESH TOPOLOGY...

MULTILAYER CERAMIC ELECTRONIC PACKAGE WITH MODULATED MESH TOPOLOGY

Printed Circuit Board with Routing of a Conductor and Dielectric St...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

SIGNAL AMPLIFICATION USING A REFERENCE PLANE WITH ALTERNATING IMPED...

SIGNAL AMPLIFICATION USING A REFERENCE PLANE WITH ALTERNATING IMPED...

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

THROUGH-MESH-PLANE VIAS IN A MULTI-LAYERED PACKAGE

HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS

HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

MESH PLANES WITH ALTERNATING SPACES FOR MULTI-LAYERED CERAMIC PACKAGES

Reduced Wiring Requirements With Signal Slope Manipulation

METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...

MESH PLANES WITH ALTERNATING SPACES FOR MULTI-LAYERED CERAMIC PACKAGES

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION

CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

ELECTRICAL DESIGN SPACE EXPLORATION

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

SPACE SOLUTION SEARCH

High-Speed Ceramic Modules with Hybrid Referencing Scheme for Impro...

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

REDUCING CROSS-TALK IN HIGH SPEED CERAMIC PACKAGES USING SELECTIVEL...

Transmission Cable with Spirally Wrapped Shielding

SWARM INTELLIGENCE FOR ELECTRICAL DESIGN SPACE MODELING AND OPTIMIZ...

REDUCED WIRING REQUIREMENTS WITH SIGNAL SLOPE MANIPULATION

SOLUTION EFFICIENCY OF GENETIC ALGORITHM APPLICATIONS