JinXiang Huang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Side contact pads for high-speed memory card
- Patent number 11,425,817
- Issue date Aug 23, 2022
- Western Digital Technologies, Inc.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board trace for galvanic effect reduction
- Patent number 11,234,327
- Issue date Jan 25, 2022
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform vacuum profile die attach tip
- Patent number 9,038,264
- Issue date May 26, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS
- Publication number 20230345633
- Publication date Oct 26, 2023
- Kent Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device with Protective Layer
- Publication number 20230260949
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD
- Publication number 20210400811
- Publication date Dec 23, 2021
- Western Digital Technologies, Inc.
- SHINENG MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM VACUUM PROFILE DIE ATTACH TIP
- Publication number 20120216396
- Publication date Aug 30, 2012
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS