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Jipu Lei
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
P—N separation metal fill for flip chip LEDs
Patent number
10,170,675
Issue date
Jan 1, 2019
Lumileds LLC
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sealed semiconductor light emitting device
Patent number
10,020,431
Issue date
Jul 10, 2018
Lumileds LLC
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing solder pad topology differences by planarization
Patent number
9,935,069
Issue date
Apr 3, 2018
Lumileds LLC
Jipu Lei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
LED having vertical contacts redistributed for flip chip mounting
Patent number
9,722,137
Issue date
Aug 1, 2017
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
P-n separation metal fill for flip chip LEDs
Patent number
9,722,161
Issue date
Aug 1, 2017
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of separating a wafer of semiconductor devices
Patent number
9,608,016
Issue date
Mar 28, 2017
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor light emitting device with thick metal layers
Patent number
9,484,513
Issue date
Nov 1, 2016
Koninklijke Philips N.V.
Stefano Schiaffino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor light emitting device with thick metal layers
Patent number
9,324,927
Issue date
Apr 26, 2016
Koninklijke Philips N.V.
Stefano Schiaffino
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
Publication number
20180323353
Publication date
Nov 8, 2018
Lumileds LLC
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
Publication number
20180019370
Publication date
Jan 18, 2018
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
Publication number
20170373235
Publication date
Dec 28, 2017
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
Publication number
20160233400
Publication date
Aug 11, 2016
Koninklijke Philips N.V.
Stefano Schiaffino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION
Publication number
20160181216
Publication date
Jun 23, 2016
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
Publication number
20160126436
Publication date
May 5, 2016
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
Publication number
20160126408
Publication date
May 5, 2016
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES
Publication number
20150140711
Publication date
May 21, 2015
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
Publication number
20150076538
Publication date
Mar 19, 2015
Koninklijke Philips N.V.
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
Publication number
20140339597
Publication date
Nov 20, 2014
Stefano Schiaffino
H01 - BASIC ELECTRIC ELEMENTS