JIQUAN LIU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,239,110
- Issue date Feb 1, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacture thereof
- Patent number 11,069,575
- Issue date Jul 20, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and manufacturing method thereof
- Patent number 11,069,565
- Issue date Jul 20, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing via RC delay
- Patent number 10,937,692
- Issue date Mar 2, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor random access memory and manufacturing method thereof
- Patent number 10,700,281
- Issue date Jun 30, 2020
- Semiconductor Manufacturing (Shanghai) International Corporation
- Changzhou Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor interconnect structure and manufacturing method thereof
- Patent number 10,290,539
- Issue date May 14, 2019
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure and fabrication method thereof
- Patent number 10,090,246
- Issue date Oct 2, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 9,852,991
- Issue date Dec 26, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction device
- Patent number 8,853,771
- Issue date Oct 7, 2014
- Shanghai Hua Hong NEC Electronics Co., Ltd.
- Liang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and fabrication methods including trench f...
- Patent number 8,779,423
- Issue date Jul 15, 2014
- Shanghai Hua Hong Nec Electronics Company, Limited
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing superjunction structure
- Patent number 8,440,529
- Issue date May 14, 2013
- Shanghai Hua Hong NEC Electronics Co., Ltd.
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200357683
- Publication date Nov 12, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiquan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190229015
- Publication date Jul 25, 2019
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
- Publication number 20190067114
- Publication date Feb 28, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiquan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20180151801
- Publication date May 31, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Changzhou Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REDUCING VIA RC DELAY
- Publication number 20180012797
- Publication date Jan 11, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180005878
- Publication date Jan 4, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Jiquan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20170062344
- Publication date Mar 2, 2017
- Semiconductor Manufacturing International (Beijing ) Corporation
- JIQUAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160351496
- Publication date Dec 1, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- JIQUAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERJUNCTION DEVICE
- Publication number 20130299896
- Publication date Nov 14, 2013
- SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
- Liang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD
- Publication number 20130105796
- Publication date May 2, 2013
- Shanghai Hua Hong NEC Electronics Company, Limited
- JIQUAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUPERJUNCTION STRUCTURE
- Publication number 20110287613
- Publication date Nov 24, 2011
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUPERJUNCTION STRUCTURE
- Publication number 20110244664
- Publication date Oct 6, 2011
- Jiquan Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure and forming method thereof

Semiconductor device and manufacture thereof

Semiconductor interconnect structure and manufacturing method thereof

Method for reducing via RC delay

Semiconductor random access memory and manufacturing method thereof

Semiconductor interconnect structure and manufacturing method thereof

Metal interconnect structure and fabrication method thereof

Semiconductor structure and fabrication method thereof

Superjunction device

Semiconductor structures and fabrication methods including trench f...

Method of manufacturing superjunction structure

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

SEMICONDUCTOR RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF

METHOD FOR REDUCING VIA RC DELAY

SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SUPERJUNCTION DEVICE

SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD

MANUFACTURING METHOD OF SUPERJUNCTION STRUCTURE

METHOD OF MANUFACTURING SUPERJUNCTION STRUCTURE