Jiraporn Seangatith

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
- Publication number 20240063180
- Publication date Feb 22, 2024
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
- Publication number 20240063072
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
- Publication number 20240063132
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...
- Publication number 20230285999
- Publication date Sep 14, 2023
- Intel Corporation
- Wenhao Li
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES
- Publication number 20230271445
- Publication date Aug 31, 2023
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Jiraporn Seangatith

Person

Patents Applicationslast 30 patents

IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES

PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES

DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING R...

REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES