JIRO KUBOTA

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Patents Grantslast 30 patents

Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,685,388
- Issue date Jun 20, 2017
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,502,368
- Issue date Nov 22, 2016
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stack of dice and support therefor
- Patent number 7,132,739
- Issue date Nov 7, 2006
- Intel Corporation
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of a stack of semiconductor dice
- Patent number 7,132,311
- Issue date Nov 7, 2006
- Intel Corporation
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless flip chip interconnection
- Patent number 6,495,397
- Issue date Dec 17, 2002
- Intel Corporation
- Jiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a multilayer interconnection structure
- Patent number 6,030,854
- Issue date Feb 29, 2000
- Intel Corporation
- Yohko Mashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiregion solder interconnection structure
- Patent number 5,880,530
- Issue date Mar 9, 1999
- Intel Corporation
- Yohko Mashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES
- Publication number 20170040238
- Publication date Feb 9, 2017
- Intel Corporation
- YOSHIHIRO TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES
- Publication number 20160172323
- Publication date Jun 16, 2016
- Intel Corporation
- YOSHIHIRO TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METH...
- Publication number 20120112336
- Publication date May 10, 2012
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated stack of dice and support therefor
- Publication number 20050085034
- Publication date Apr 21, 2005
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation of a stack of semiconductor dice
- Publication number 20040016939
- Publication date Jan 29, 2004
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS FLIP CHIP INTERCONNECTION
- Publication number 20020140094
- Publication date Oct 3, 2002
- Jiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED UNDERFILL PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20020089836
- Publication date Jul 11, 2002
- KENZO ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS