Jiro Matsumoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Patent number 8,044,507
- Issue date Oct 25, 2011
- Oki Semiconductor Co., Ltd.
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Patent number 7,800,221
- Issue date Sep 21, 2010
- Oki Semiconductor Co., Ltd.
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Patent number 7,309,919
- Issue date Dec 18, 2007
- Oki Electric Industry Co., Ltd.
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor device by using sealing appa...
- Patent number 6,682,958
- Issue date Jan 27, 2004
- Oki Electric Industry Co., Ltd.
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Publication number 20110003026
- Publication date Jan 6, 2011
- Oki Semiconductor Co., Ltd.
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Publication number 20080038400
- Publication date Feb 14, 2008
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Publication number 20040135171
- Publication date Jul 15, 2004
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Sealing apparatus for semiconductor wafer, mold of sealing apparatu...
- Publication number 20020140114
- Publication date Oct 3, 2002
- Jiro Matsumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL