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Mie, JP
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Patents Grants
last 30 patents
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Patent Grant
Filament for material extrusion 3D printer molding and production m...
Patent number
11,268,214
Issue date
Mar 8, 2022
MCPP Innovation LLC
Jiro Sano
B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
Resin Sheet and Circuit Board Material Using the Same
Publication number
20230007767
Publication date
Jan 5, 2023
MCPP Innovation LLC
Yuuko Hayakawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
FILAMENT FOR MATERIAL EXTRUSION 3D PRINTER MOLDING AND PRODUCTION M...
Publication number
20180038015
Publication date
Feb 8, 2018
MCPP Innovation LLC
Jiro SANO
D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING