Jisoon PARK

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Technology and method for selectively providing network function to...
- Patent number 11,606,457
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Jisoon Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices with through electrodes and methods of fabric...
- Patent number 9,852,965
- Issue date Dec 26, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a TSV, a front-side bumping pad, and a...
- Patent number 9,806,004
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes capped with self-al...
- Patent number 9,570,377
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor devices having through electr...
- Patent number 9,543,200
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer loaders having buffer zones
- Patent number 9,502,274
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and method of fabricating semiconductor device using the same
- Patent number 9,496,163
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- HyungJun Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGY AND METHOD FOR SELECTIVELY PROVIDING NETWORK FUNCTION TO...
- Publication number 20210067625
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Jisoon PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES WITH THROUGH ELECTRODES AND METHODS OF FABRIC...
- Publication number 20170047270
- Publication date Feb 16, 2017
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A TSV, A FRONT-SIDE BUMPING PAD, AND A...
- Publication number 20160155686
- Publication date Jun 2, 2016
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES CAPPED WITH SELF-AL...
- Publication number 20150287680
- Publication date Oct 8, 2015
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20150162235
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LOADERS HAVING BUFFER ZONES
- Publication number 20150068948
- Publication date Mar 12, 2015
- Samsung Electronics Co., Ltd.
- Yi Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR DEVICES HAVING THROUGH ELECTR...
- Publication number 20140357077
- Publication date Dec 4, 2014
- Samsung Electronics Co., Ltd.
- SOYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Semiconductor Devices Having Through Electr...
- Publication number 20140235052
- Publication date Aug 21, 2014
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS

Jisoon PARK

Person

Patents Grantslast 30 patents

Technology and method for selectively providing network function to...

Semiconductor devices with through electrodes and methods of fabric...

Semiconductor devices having a TSV, a front-side bumping pad, and a...

Semiconductor devices having through electrodes capped with self-al...

Methods for fabricating semiconductor devices having through electr...

Wafer loaders having buffer zones

Carrier and method of fabricating semiconductor device using the same

Patents Applicationslast 30 patents

TECHNOLOGY AND METHOD FOR SELECTIVELY PROVIDING NETWORK FUNCTION TO...

SEMICONDUCTOR DEVICES WITH THROUGH ELECTRODES AND METHODS OF FABRIC...

SEMICONDUCTOR DEVICES HAVING A TSV, A FRONT-SIDE BUMPING PAD, AND A...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES CAPPED WITH SELF-AL...

CARRIER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

WAFER LOADERS HAVING BUFFER ZONES

METHODS FOR FABRICATING SEMICONDUCTOR DEVICES HAVING THROUGH ELECTR...

Methods for Fabricating Semiconductor Devices Having Through Electr...