JiSun Hong

Follow

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrates
- Patent number 10,256,181
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,032,706
- Issue date Jul 24, 2018
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,112,062
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer level package and semiconductor device fabricated...
- Patent number 8,558,371
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20180315698
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20170077041
- Publication date Mar 16, 2017
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140117506
- Publication date May 1, 2014
- JiSun HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Wafer Level Package and Semiconductor Device Fabricated...
- Publication number 20110233706
- Publication date Sep 29, 2011
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS