Jitae KIM

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inductor and capacitor integrated on a substrate
- Patent number 10,470,309
- Issue date Nov 5, 2019
- QUALCOMM Incorporated
- Mete Erturk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor capacitors and methods for fabricating high qua...
- Patent number 9,773,862
- Issue date Sep 26, 2017
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor capacitors and methods for fabricating high qua...
- Patent number 9,548,350
- Issue date Jan 17, 2017
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical transceiver device to enable chip-to-chip interconn...
- Patent number 9,325,420
- Issue date Apr 26, 2016
- QUALCOMM Incorporated
- Kwan-yu Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integration of a coil and a discontinuous magnetic core
- Patent number 9,293,245
- Issue date Mar 22, 2016
- QUALCOMM MEMS Technologies, Inc.
- Philip Jason Stephanou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH QUALITY FACTOR CAPACITORS AND METHODS FOR FABRICATING HIGH QUA...
- Publication number 20170125512
- Publication date May 4, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE ON A SUBSTRATE
- Publication number 20170086295
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Mete ERTURK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED THIN FILM MAGNETIC CARRIER FOR INTEGRATED VOLTAGE REGULATOR
- Publication number 20160163443
- Publication date Jun 9, 2016
- QUALCOMM Incorporated
- Mete ERTURK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL TRANSCEIVER DEVICE TO ENABLE CHIP-TO-CHIP INTERCONN...
- Publication number 20150333831
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Kwan-yu Lai
- G02 - OPTICS
Information Patent Application
LANDSIDE EMBEDDED INDUCTOR FOR FANOUT PACKAGING
- Publication number 20150311271
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Mete ERTURK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR CAPACITORS AND METHODS FOR FABRICATING HIGH QUA...
- Publication number 20150228712
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A COIL AND A DISCONTINUOUS MAGNETIC CORE
- Publication number 20150035638
- Publication date Feb 5, 2015
- QUALCOMM MEMS Technologies Inc.
- Philip Jason Stephanou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INDUCTORS
- Publication number 20140104284
- Publication date Apr 17, 2014
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Ravindra V. Shenoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INDUCTORS
- Publication number 20140104288
- Publication date Apr 17, 2014
- Ravindra V. Shenoy
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Inductor and capacitor integrated on a substrate

High quality factor capacitors and methods for fabricating high qua...

High quality factor capacitors and methods for fabricating high qua...

Electro-optical transceiver device to enable chip-to-chip interconn...

Integration of a coil and a discontinuous magnetic core

Patents Applicationslast 30 patents

HIGH QUALITY FACTOR CAPACITORS AND METHODS FOR FABRICATING HIGH QUA...

INTEGRATED PASSIVE ON A SUBSTRATE

EMBEDDED THIN FILM MAGNETIC CARRIER FOR INTEGRATED VOLTAGE REGULATOR

ELECTRO-OPTICAL TRANSCEIVER DEVICE TO ENABLE CHIP-TO-CHIP INTERCONN...

LANDSIDE EMBEDDED INDUCTOR FOR FANOUT PACKAGING

HIGH QUALITY FACTOR CAPACITORS AND METHODS FOR FABRICATING HIGH QUA...

INTEGRATION OF A COIL AND A DISCONTINUOUS MAGNETIC CORE

THROUGH SUBSTRATE VIA INDUCTORS

THROUGH SUBSTRATE VIA INDUCTORS