Jitesh Shah

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged integrated circuits having high-Q inductors therein and me...
- Patent number 9,397,151
- Issue date Jul 19, 2016
- Integrated Device Technology, Inc.
- Kenneth L. Astrof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bump array with superior signal performance
- Patent number 9,332,629
- Issue date May 3, 2016
- Integrated Device Technology, Inc.
- Jitesh Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test assembly for verifying heat spreader grounding in a production...
- Patent number 8,823,407
- Issue date Sep 2, 2014
- Integrated Device Technology, Inc.
- Jitesh A. Shah
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame package
- Patent number 8,294,249
- Issue date Oct 23, 2012
- Integrated Device Technology Inc.
- David J. Pilling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with improved connection of a decoupling capacitor
- Patent number 8,120,162
- Issue date Feb 21, 2012
- Integrated Device Technology, Inc.
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package slot array
- Patent number 7,968,989
- Issue date Jun 28, 2011
- Integrated Device Technology, Inc.
- Camille Kokozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with inserted discrete capacitors
- Patent number 7,656,007
- Issue date Feb 2, 2010
- Integrated Device Technology Inc.
- Jitesh Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus with power and ground strips for connecting to...
- Patent number 7,329,958
- Issue date Feb 12, 2008
- Integrated Device Technology, Inc.
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked paddle micro leadframe package
- Patent number 7,166,905
- Issue date Jan 23, 2007
- Integrated Device Technology, Inc.
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GAS SENSOR
- Publication number 20180196022
- Publication date Jul 12, 2018
- Integrated Device Technology, Inc.
- Srikanth KULKARNI
- G01 - MEASURING TESTING
Information Patent Application
TEST ASSEMBLY FOR VERIFYING HEAT SPREADER GROUNDING IN A PRODUCTION...
- Publication number 20130229201
- Publication date Sep 5, 2013
- Jitesh Shah
- G01 - MEASURING TESTING
Information Patent Application
UTILIZING A JUMPER CHIP IN PACKAGES WITH LONG BONDING WIRES
- Publication number 20120286409
- Publication date Nov 15, 2012
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BUMP ARRAY WITH SUPERIOR SIGNAL PERFORMANCE
- Publication number 20120104596
- Publication date May 3, 2012
- Integrated Device Technology, Inc., a Delaware Corporation
- Jitesh Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME PACKAGE
- Publication number 20100032818
- Publication date Feb 11, 2010
- David J. Pilling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Package Ball Grid Array
- Publication number 20090321905
- Publication date Dec 31, 2009
- Integrated Device Technology, Inc.
- Camille Kokozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with improved connection of a decoupling capacitor
- Publication number 20090085158
- Publication date Apr 2, 2009
- Integrated Device Technology, Inc.
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with passive component support assembly
- Publication number 20090086453
- Publication date Apr 2, 2009
- Integrated Device Technology, Inc.
- Jitesh Shah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package substrate with inserted discrete capacitors
- Publication number 20080099901
- Publication date May 1, 2008
- Jitesh Shah
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package assembly pinout with superior crosstalk and timing performance
- Publication number 20080079135
- Publication date Apr 3, 2008
- Jitesh Shah
- H01 - BASIC ELECTRIC ELEMENTS

Jitesh Shah

Person

Patents Grantslast 30 patents

Packaged integrated circuits having high-Q inductors therein and me...

Flip chip bump array with superior signal performance

Test assembly for verifying heat spreader grounding in a production...

Lead frame package

Package with improved connection of a decoupling capacitor

Multi-package slot array

Package substrate with inserted discrete capacitors

Method and apparatus with power and ground strips for connecting to...

Stacked paddle micro leadframe package

Patents Applicationslast 30 patents

GAS SENSOR

TEST ASSEMBLY FOR VERIFYING HEAT SPREADER GROUNDING IN A PRODUCTION...

UTILIZING A JUMPER CHIP IN PACKAGES WITH LONG BONDING WIRES

FLIP CHIP BUMP ARRAY WITH SUPERIOR SIGNAL PERFORMANCE

LEAD FRAME PACKAGE

Multi-Package Ball Grid Array

Package with improved connection of a decoupling capacitor

Package with passive component support assembly

Package substrate with inserted discrete capacitors

Package assembly pinout with superior crosstalk and timing performance