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Jitesh Vaswani
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Chandler, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Bond wire array for packaged semiconductor device
Patent number
11,049,837
Issue date
Jun 29, 2021
NXP USA, INC.
Jitesh Vaswani
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Impedance matching circuit for RF devices and method therefor
Patent number
10,707,180
Issue date
Jul 7, 2020
NXP USA, INC.
Ricardo Uscola
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
POWER TRANSISTOR DEVICES AND AMPLIFIERS WITH INPUT-SIDE HARMONIC TE...
Publication number
20230216452
Publication date
Jul 6, 2023
NXP USA, Inc.
Jitesh Vaswani
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
BOND WIRE ARRAY FOR PACKAGED SEMICONDUCTOR DEVICE
Publication number
20210035942
Publication date
Feb 4, 2021
NXP USA, Inc.
Jitesh VASWANI
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR
Publication number
20190326233
Publication date
Oct 24, 2019
NXP USA, Inc.
Ricardo Uscola
H01 - BASIC ELECTRIC ELEMENTS