Jitsuho Hirota

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder supplying method, solder supplying apparatus and soldering m...
- Patent number 5,950,908
- Issue date Sep 14, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a microelectronic device
- Patent number 5,302,550
- Issue date Apr 12, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Jitsuho Hirota
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a wire bonding ball
- Patent number 4,739,142
- Issue date Apr 19, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Jitsuho Hirota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of ball forming for wire bonding
- Patent number 4,705,204
- Issue date Nov 10, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Jitsuho Hirota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR