Jiun-Chan Yang

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming substrate interconnect structures for enhanced t...
- Patent number 11,652,067
- Issue date May 16, 2023
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING SUBSTRATE INTERCONNECT STRUCTURES FOR ENHANCED T...
- Publication number 20200402921
- Publication date Dec 24, 2020
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS