Jiun Hann Sir

Person

Gelugor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-use package architecture
- Patent number 11,929,295
- Issue date Mar 12, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,908,793
- Issue date Feb 20, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
- Patent number 11,823,994
- Issue date Nov 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,699,644
- Issue date Jul 11, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFI free picture frame metal stiffener
- Patent number 11,658,127
- Issue date May 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 11,658,111
- Issue date May 23, 2023
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package on package (POP)
- Patent number 11,587,844
- Issue date Feb 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination stiffener and capacitor
- Patent number 11,538,633
- Issue date Dec 27, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 11,393,760
- Issue date Jul 19, 2022
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-to-bottom interconnects with molded lead-frame module for integ...
- Patent number 11,322,434
- Issue date May 3, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing a pad on solder...
- Patent number 11,289,414
- Issue date Mar 29, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended package air core inductor
- Patent number 11,264,160
- Issue date Mar 1, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with passive component between substrates
- Patent number 11,264,315
- Issue date Mar 1, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic mold interconnects in shielded interconnects frames for int...
- Patent number 11,205,613
- Issue date Dec 21, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripped redistrubution-layer fabrication for package-top embedded...
- Patent number 10,998,262
- Issue date May 4, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having integrated stiffener region
- Patent number 10,923,415
- Issue date Feb 16, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 10,796,999
- Issue date Oct 6, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive interconnect in a semiconductor package
- Patent number 10,609,813
- Issue date Mar 31, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 10,515,912
- Issue date Dec 24, 2019
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-height electronic memory system and method
- Patent number 10,256,213
- Issue date Apr 9, 2019
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for semiconductor packages
- Patent number 10,163,777
- Issue date Dec 25, 2018
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate with microstrip architecture a...
- Patent number 9,972,589
- Issue date May 15, 2018
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three capacitor stack and associated methods
- Patent number 9,960,224
- Issue date May 1, 2018
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible system-in-package solutions for wearable devices
- Patent number 9,778,688
- Issue date Oct 3, 2017
- Intel Corporation
- Jiamiao Tang
- A43 - FOOTWEAR
Information Patent Grant
Interconnects with interlocks
- Patent number 7,795,736
- Issue date Sep 14, 2010
- Intel Corporation
- Jiun Hann Sir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress absorption layer and cylinder solder joint method and apparatus
- Patent number 7,745,912
- Issue date Jun 29, 2010
- Intel Corporation
- Jiun Hann Sir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management method including a metallic layer directly on an...
- Patent number 7,678,616
- Issue date Mar 16, 2010
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit thermal management method and apparatus
- Patent number 7,439,618
- Issue date Oct 21, 2008
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with direct metalization and conductive polymer
- Patent number 7,365,007
- Issue date Apr 29, 2008
- Intel Corporation
- Jiun Hann Sir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnects with interlocks
- Patent number 7,217,651
- Issue date May 15, 2007
- Intel Corporation
- Jiun Hann Sir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20240136278
- Publication date Apr 25, 2024
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
- Publication number 20240113033
- Publication date Apr 4, 2024
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- Publication number 20240106139
- Publication date Mar 28, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
- Publication number 20240071948
- Publication date Feb 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES
- Publication number 20240006338
- Publication date Jan 4, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
- Publication number 20230397323
- Publication date Dec 7, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERCONNECT MEMORY ON PACKAGE
- Publication number 20230369232
- Publication date Nov 16, 2023
- Intel Corporation
- Hazwani Jaffar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...
- Publication number 20230178502
- Publication date Jun 8, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20220230958
- Publication date Jul 21, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE PACKAGE ARCHITECTURE
- Publication number 20220181227
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A PAD ON SOLDER...
- Publication number 20220173027
- Publication date Jun 2, 2022
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
- Publication number 20220139814
- Publication date May 5, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20220077047
- Publication date Mar 10, 2022
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20210202380
- Publication date Jul 1, 2021
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...
- Publication number 20210098352
- Publication date Apr 1, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...
- Publication number 20210057318
- Publication date Feb 25, 2021
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE ON PACKAGE (POP)
- Publication number 20210035880
- Publication date Feb 4, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION STIFFENER AND CAPACITOR
- Publication number 20210035738
- Publication date Feb 4, 2021
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20200411438
- Publication date Dec 31, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFI FREE PICTURE FRAME METAL STIFFENER
- Publication number 20200411448
- Publication date Dec 31, 2020
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...
- Publication number 20200328151
- Publication date Oct 15, 2020
- Intel Corporation
- Jiun Hann Sir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED PACKAGE AIR CORE INDUCTOR
- Publication number 20200027639
- Publication date Jan 23, 2020
- INTEL CORPORATION
- Eng Huat Goh
- G05 - CONTROLLING REGULATING
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20190304914
- Publication date Oct 3, 2019
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE PACKAGE ARCHITECTURE
- Publication number 20190287872
- Publication date Sep 19, 2019
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTEGRATED STIFFENER REGION
- Publication number 20190214338
- Publication date Jul 11, 2019
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A PAD ON SOLDER...
- Publication number 20190122974
- Publication date Apr 25, 2019
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
- Publication number 20190103346
- Publication date Apr 4, 2019
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...
- Publication number 20190103357
- Publication date Apr 4, 2019
- Intel Corporation
- Min Suet Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20190096833
- Publication date Mar 28, 2019
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS

Jiun Hann Sir

Person

Patents Grantslast 30 patents

Multi-use package architecture

Stripped redistrubution-layer fabrication for package-top embedded...

Systems and apparatuses for implementing a pad on solder mask (POSM...

Organic mold interconnects in shielded interconnects frames for int...

RFI free picture frame metal stiffener

Stripped redistrubution-layer fabrication for package-top embedded...

Electronic device package on package (POP)

Combination stiffener and capacitor

Floating-bridge interconnects and methods of assembling same

Top-to-bottom interconnects with molded lead-frame module for integ...

Systems, methods, and apparatuses for implementing a pad on solder...

Extended package air core inductor

Electronic package with passive component between substrates

Organic mold interconnects in shielded interconnects frames for int...

Stripped redistrubution-layer fabrication for package-top embedded...

Semiconductor package having integrated stiffener region

Floating-bridge interconnects and methods of assembling same

Capacitive interconnect in a semiconductor package

Integrated circuit packages

Reduced-height electronic memory system and method

Interconnects for semiconductor packages

Integrated circuit package substrate with microstrip architecture a...

Three capacitor stack and associated methods

Flexible system-in-package solutions for wearable devices

Interconnects with interlocks

Stress absorption layer and cylinder solder joint method and apparatus

Thermal management method including a metallic layer directly on an...

Integrated circuit thermal management method and apparatus

Interconnects with direct metalization and conductive polymer

Interconnects with interlocks

Patents Applicationslast 30 patents

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION

SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...

MOLDED INTERCONNECT MEMORY ON PACKAGE

METHODS AND APPARATUS TO REDUCE THICKNESS OF ON-PACKAGE MEMORY ARCH...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

MULTI-USE PACKAGE ARCHITECTURE

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A PAD ON SOLDER...

ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INT...

TOP-TO-BOTTOM INTERCONNECTS WITH MOLDED LEAD-FRAME MODULE FOR INTEG...

ELECTRONIC DEVICE PACKAGE ON PACKAGE (POP)

COMBINATION STIFFENER AND CAPACITOR

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

RFI FREE PICTURE FRAME METAL STIFFENER

STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED...

EXTENDED PACKAGE AIR CORE INDUCTOR

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

MULTI-USE PACKAGE ARCHITECTURE

SEMICONDUCTOR PACKAGE HAVING INTEGRATED STIFFENER REGION

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A PAD ON SOLDER...

ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES

METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...

INTEGRATED CIRCUIT PACKAGES