Jiun Ren Lai

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a 3D IC architecture including forming a first d...
- Patent number 10,923,431
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC architecture with interposer and interconnect structure for b...
- Patent number 10,297,550
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240105632
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Interposer or Bonding Dies
- Publication number 20210167018
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Interposer for Bonding Dies
- Publication number 20190273046
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Die Inside Interposer
- Publication number 20110193235
- Publication date Aug 11, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Architecture with Interposer for Bonding Dies
- Publication number 20110193221
- Publication date Aug 11, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Jiun Ren Lai

Person

Patents Grantslast 30 patents

Method for forming a semiconductor device having TSV formed through...

Method for forming a 3D IC architecture including forming a first d...

3D IC architecture with interposer and interconnect structure for b...

Patents Applicationslast 30 patents

Method for Forming a Semiconductor Device Having TSV Formed Through...

Method for Forming a Semiconductor Device Having TSV Formed Through...

3DIC Architecture with Interposer or Bonding Dies

3DIC Architecture with Interposer for Bonding Dies

3DIC Architecture with Die Inside Interposer

3DIC Architecture with Interposer for Bonding Dies