Jiun-Ruey Chen

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC FOR TRANSITION METAL DICHA...
- Publication number 20230420510
- Publication date Dec 28, 2023
- Intel Corporation
- Carl H. NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...
- Publication number 20230197602
- Publication date Jun 22, 2023
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS
- Publication number 20230197836
- Publication date Jun 22, 2023
- Intel Corporation
- Carl Hugo Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...
- Publication number 20230197601
- Publication date Jun 22, 2023
- Intel Corporation
- Jiun-Ruey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...
- Publication number 20220139772
- Publication date May 5, 2022
- Intel Corporation
- Christoper Jezewski
- H01 - BASIC ELECTRIC ELEMENTS

Jiun-Ruey Chen

Person

Patents Grantslast 30 patents

Subtractively patterned interconnect structures for integrated circ...

Subtractively patterned interconnect structures for integrated circ...

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC FOR TRANSITION METAL DICHA...

STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION W...

INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS

FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MAT...