Jiun Yi Wu

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,362,228
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,354,969
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having circuit carrier
- Patent number 12,356,558
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method
- Patent number 12,354,924
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,334,446
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including photonic package having embedded optica...
- Patent number 12,334,362
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,308,343
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods, where first and second transmissi...
- Patent number 12,272,855
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,272,631
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising interconnect structures
- Patent number 12,249,518
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including cavity-mounted device
- Patent number 12,243,829
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier
- Patent number 12,237,382
- Issue date Feb 25, 2025
- WIN SEMICONDUCTORS CORP.
- Chieh-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with integrated optical die and method forming same
- Patent number 12,228,776
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,589
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package
- Patent number 12,217,976
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,218,020
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,218,021
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetrical substrate for semiconductor packaging
- Patent number 12,205,879
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,191,251
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250237830
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PHOTONIC DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20250237827
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTOSE...
- Publication number 20250241075
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao CHIANG
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTO-S...
- Publication number 20250241086
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao CHIANG
Information Patent Application
FIBER ARRAY UNIT INCLUDING FRONT SIDE MIRROR AND METHOD OF MAKING T...
- Publication number 20250231350
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hung Lo
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING PHOTODETECTOR AND MANUFACTURING M...
- Publication number 20250234659
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao CHIANG
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250228016
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao CHIANG
Information Patent Application
INTEGRATED FIBER ARRAY UNIT STRUCTURE INCLUDING EMBEDDED PASSIVE OP...
- Publication number 20250199251
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Jen WANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Interconnect Structures
- Publication number 20250183056
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174580
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER
- Publication number 20250169146
- Publication date May 22, 2025
- WIN SEMICONDUCTORS CORP.
- Chieh-Chih HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH PHOTONIC INTEGRATED CIRCUIT CHIP AND ME...
- Publication number 20250138258
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...
- Publication number 20250143011
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250130380
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING PACKAGE
- Publication number 20250132169
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD
- Publication number 20250126723
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20250087641
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20250079368
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC ASSEMBLY INCLUDING AN EMBEDDED OPTICAL CONNECTOR DIE AND M...
- Publication number 20250052962
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240427081
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ning Weng
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME
- Publication number 20240411093
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
SYMMETRICAL SUBSTRATE FOR SEMICONDUCTOR PACKAGING
- Publication number 20240395685
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and method comprising formation of redistribu...

Hybrid integrated circuit packages

Semiconductor package and method

Semiconductor device and method of manufacture

Electronic assembly having circuit carrier

Integrated circuit package and method

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor package and method

Package structure including photonic package having embedded optica...

Semiconductor device and method of forming the same

Semiconductor package and method of forming thereof

Semiconductor device and methods, where first and second transmissi...

Semiconductor package having multiple substrates

Semiconductor structure and forming method thereof

Semiconductor device comprising interconnect structures

Package structure, RDL structure comprising redistribution layer ha...

Integrated circuit package and method of forming same

Interconnect structure having conductor extending along dielectric...

Semiconductor package including cavity-mounted device

Semiconductor device and power amplifier

Package with integrated optical die and method forming same

Semiconductor package

Method of fabricating package

Semiconductor packages

Semiconductor packages and methods of forming the same

Semiconductor package having multiple substrates

Symmetrical substrate for semiconductor packaging

Electronics card including multi-chip module

Circuit board and semiconductor device including the same

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

OPTICAL DEVICES AND METHODS OF MANUFACTURE

PHOTONIC DEVICE AND FABRICATING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTOSE...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTO-S...

FIBER ARRAY UNIT INCLUDING FRONT SIDE MIRROR AND METHOD OF MAKING T...

SEMICONDUCTOR STRUCTURE INCLUDING PHOTODETECTOR AND MANUFACTURING M...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

INTEGRATED FIBER ARRAY UNIT STRUCTURE INCLUDING EMBEDDED PASSIVE OP...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

Semiconductor Device Comprising Interconnect Structures

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE STRUCTURE WITH PHOTONIC INTEGRATED CIRCUIT CHIP AND ME...

PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...

OPTICAL DEVICES AND METHODS OF MANUFACTURE

METHOD OF FABRICATING PACKAGE

METHOD FOR FORMING CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Manufacture

Semiconductor Device Package and Method of Manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PHOTONIC ASSEMBLY INCLUDING AN EMBEDDED OPTICAL CONNECTOR DIE AND M...

OPTICAL DEVICE AND METHOD OF MANUFACTURE

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME

SYMMETRICAL SUBSTRATE FOR SEMICONDUCTOR PACKAGING