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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method
Patent number
12,021,053
Issue date
Jun 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
12,002,767
Issue date
Jun 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warpage control of packages using embedded core frame
Patent number
11,984,374
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,984,375
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,961,814
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,955,442
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,935,761
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and method of manufacture
Patent number
11,894,312
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,894,318
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,862,714
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Shiung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,854,988
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,855,057
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method comprising formation of redistribu...
Patent number
11,848,234
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
11,848,304
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,837,567
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,830,797
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
11,824,032
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming same
Patent number
11,817,380
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor package
Patent number
11,817,325
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,810,847
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,791,275
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,784,140
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Symmetrical substrate for semiconductor packaging
Patent number
11,776,886
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stencil structure and method of fabricating package
Patent number
11,756,801
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and methods of manufacture
Patent number
11,756,945
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,749,594
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Lin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure having conductor extending along dielectric...
Patent number
11,737,205
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package structure and method of forming same
Patent number
11,728,217
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,715,686
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming the same
Patent number
11,705,378
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240203907
Publication date
Jun 20, 2024
Taiwan Semiconductor Manfacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
Publication number
20240170350
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20240096812
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
Publication number
20240096825
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240088269
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun Shiung WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240077669
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
G02 - OPTICS
Information
Patent Application
Semiconductor Device and Method of Forming the Same
Publication number
20240063177
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR ACQUIRING TELECOMMUNICATION REGULATIONS AND SYSTEM APPLY...
Publication number
20240040475
Publication date
Feb 1, 2024
Realtek Semiconductor Corp.
JIUN-LE WU
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Semiconductor Device and Method of Manufacturing
Publication number
20240030151
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Having Multiple Substrates
Publication number
20240021506
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYMMETRICAL SUBSTRATE FOR SEMICONDUCTOR PACKAGING
Publication number
20240021510
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Thereof
Publication number
20240021564
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method
Publication number
20240021467
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Same
Publication number
20240021511
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20230386986
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBU...
Publication number
20230386919
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
Publication number
20230387061
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Thereof
Publication number
20230386866
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICA...
Publication number
20230377907
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
G02 - OPTICS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
Publication number
20230378150
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20230369274
Publication date
Nov 16, 2023
Taiwan Semiconduction Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20230369249
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE
Publication number
20230369066
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
Publication number
20230354503
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230352389
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Lin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20230326850
Publication date
Oct 12, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSMISSION LINES AND METHOD OF FOR...
Publication number
20230307813
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230307385
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230307305
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jung-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS