Jiung-Yue TIEN

Person

Taichung County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure of a microphone
- Patent number 7,884,467
- Issue date Feb 8, 2011
- Lingsen Precision Industries, Ltd.
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cap package for micro electro-mechanical system
- Patent number 7,511,373
- Issue date Mar 31, 2009
- Lingsen Precision Inductries, Ltd.
- Jiung-Yue Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR MEMS MICROPHONE
- Publication number 20090180655
- Publication date Jul 16, 2009
- Lingsen Precision Industries, Ltd.
- Jiung-Yue TIEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package structure of a microphone
- Publication number 20080285784
- Publication date Nov 20, 2008
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE
- Publication number 20080164583
- Publication date Jul 10, 2008
- Lingsen Precision Industries, Ltd.
- Jiung-Yue Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM CAPABLE OF MINIMIZI...
- Publication number 20080164602
- Publication date Jul 10, 2008
- Lingsen Precision Industries, Ltd.
- Jiung-Yue Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM
- Publication number 20080164594
- Publication date Jul 10, 2008
- Lingsen Precision Industries, Ltd.
- Jiung-Yue TIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEM MODULE PACKAGE CAPABLE OF MINIMIZIN...
- Publication number 20080079141
- Publication date Apr 3, 2008
- Lingsen Precision Industries, Ltd.
- Jiung-Yue Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package structure of a microphone
- Publication number 20070182002
- Publication date Aug 9, 2007
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Acoustic head structure of a microphone
- Publication number 20070165898
- Publication date Jul 19, 2007
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Jiung-Yue TIEN

Person

Patents Grantslast 30 patents

Package structure of a microphone

Cap package for micro electro-mechanical system

Patents Applicationslast 30 patents

PACKAGE FOR MEMS MICROPHONE

Package structure of a microphone

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM CAPABLE OF MINIMIZI...

CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM

MICRO ELECTRO-MECHANICAL SYSTEM MODULE PACKAGE CAPABLE OF MINIMIZIN...

Package structure of a microphone

Acoustic head structure of a microphone